2021 IEEE 25th Workshop on Signal and Power Integrity (SPI)
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9781665423885
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Analysis of Differential Crosstalk and Transmission for Via Arrays in Low Temperature Cofired Ceramics

2021 ◽  
Author(s):  
Omer F. Yildiz ◽  
Nico Pathe ◽  
Marc Bochard ◽  
Cheng Yang ◽  
Christian Schuster
Keyword(s):  
Low Temperature ◽  
Cofired Ceramics

Intra-Pair Skew Metric, EIPS (Effective Intra-Pair Skew)

2021 ◽  
Author(s):  
Se-Jung Moon ◽  
Jianting Li ◽  
Xinjun Zhang ◽  
Chien-Ping Kao ◽  
Beomtaek Lee ◽  
...  

Machine Learning-Based Verilog-A Modeling for Power Distribution Network of On-Die Regulator

2021 ◽  
Author(s):  
Michael Chang ◽  
Simon Kao ◽  
Stephen Chu ◽  
Bryant Hsu ◽  
Mark Ciou ◽  
...  
Keyword(s):  
Machine Learning ◽  
Power Distribution ◽  
Distribution Network ◽  
Power Distribution Network

A Tunable Macro-Modeling Method for Signal Transition in mm-Wave Flip-Chip Technology

2021 ◽  
Author(s):  
Pouya Namaki ◽  
Nasser Masoumi ◽  
Mohammad-Reza Nezhad-Ahmadi ◽  
Safieddin Safavi-Naeini
Keyword(s):  
Flip Chip ◽  
Modeling Method ◽  
Macro Modeling ◽  
Chip Technology

Electrothermal Modeling and Characterization of Graphene-Based Thin Strips

2021 ◽  
Author(s):  
A. Maffucci ◽  
L. Ferrigno ◽  
S. Sibilia ◽  
F. Bertocchi ◽  
S. Chiodini ◽  
...  

De-mystifying the impact of Intra-pair Skew on high-speed SerDes Interconnect

2021 ◽  
Author(s):  
Hansel Dsilva ◽  
Scott McMorrow ◽  
Adam Gregory ◽  
Steve Krooswyk ◽  
Richard Mellitz ◽  
...  
Keyword(s):  
High Speed ◽  
The Impact
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