2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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142

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5

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Published By IEEE

9781457713897, 9781457713873, 9781457713880

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Capability evaluation and validation of FC chip scale package structure

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2011.6117154 ◽

2011 ◽

Author(s):

Kenet Liu ◽

Eason Chen ◽

Daniel Lee ◽

Mike Ma

Keyword(s):

Chip Scale Package ◽

Capability Evaluation

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Co-simulation of capacitive coupling pads assignment for capacitive coupling interconnection applications

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2011.6117216 ◽

2011 ◽

Author(s):

Sheng-Feng Hsiao ◽

Ming-Kun Chen ◽

Yi-Lung Lin ◽

Yu-Jung Huang ◽

Shen-Li Fu

Keyword(s):

Capacitive Coupling

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Poster session: Index

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2011.6117190 ◽

2011 ◽

Keyword(s):

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Session 16: Index

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2011.6117202 ◽

2011 ◽

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New PC board structure for power supply technology over GHz frequency verificated with 32bit SSN driver system

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2011.6117167 ◽

2011 ◽

Author(s):

Norifumi Sasaoka ◽

Takafumi Ochi ◽

Yutaka Akiyama ◽

Kazuo Kono ◽

Chihiro Ueda ◽

...

Keyword(s):

Power Supply ◽

Board Structure

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Leadless IC package with a substrate produced by copper/nickel/copper-3-layer-clad material

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2011.6117160 ◽

2011 ◽

Author(s):

Hironao Okayama ◽

Kouji Nanbu ◽

Teppei Kurokawa ◽

Takashi Koushiro

Keyword(s):

Copper Nickel ◽

Nickel Copper ◽

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Thermal performance study of next generation fine-pitch chip-on-film (COF) packages — A numerical study

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2011.6117266 ◽

2011 ◽

Author(s):

De-Shin Liu ◽

Shu-Shen Yeh ◽

Chieh-Jung Lu ◽

Chan-Wei Chang ◽

Chen-Wei Hung ◽

...

Keyword(s):

Thermal Performance ◽

Numerical Study ◽

Next Generation ◽

Performance Study ◽

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Effect of orientation of phosphinate pendant on the transparency of polyimides: Design and synthesis of phosphinated diamines with a bulky ortho substitution for high-Tg, transparent polyimides

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2011.6117286 ◽

2011 ◽

Author(s):

Sheng Lung Chang ◽

Ching Hsuan Lin ◽

Sinn Wen Chen

Keyword(s):

Design And Synthesis

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Modeling of moisture diffusion in heterogeneous epoxy resin containing multiple randomly distributed particles using finite element method

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2011.6117269 ◽

2011 ◽

Author(s):

De-Shin Liu ◽

I-Hung Lin

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Epoxy Resin ◽

Moisture Diffusion ◽

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Design and experimental verifications of an integrated micro-gyroscope

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2011.6117259 ◽

2011 ◽

Author(s):

Sheng-Ren Chiu ◽

Chung-Yang Sue ◽

Shih-Ting Lin ◽

Shih-Chieh Lin ◽

Yu-Wen Hsu ◽

...

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