2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
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9781467307420, 9781467307437, 9781467307413
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Low temperature direct bonding assisted by CMP and plasma activation

2012 ◽  
Author(s):  
H. Moriceau ◽  
F. Rieutord ◽  
F. Fournel ◽  
B. Imbert ◽  
L. DiCioccio ◽  
...  
Keyword(s):  
Low Temperature ◽  
Plasma Activation

Low temperature Au-Au flip chip bonding with VUV/O3 treatment for 3D integration

2012 ◽  
Author(s):  
Akiko Okada ◽  
Masatsugu Nimura ◽  
Naoko Unami ◽  
Akitsu Shigetou ◽  
Hirokazu Noma ◽  
...  
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
3D Integration ◽  
Flip Chip Bonding
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