Two-dimensional ferroelasticity in van der Waals β’-In2Se3

Two-dimensional (2D) materials exhibit remarkable mechanical properties, enabling their applications as flexible and stretchable ultrathin devices. As the origin of several extraordinary mechanical behaviors, ferroelasticity has also been predicted theoretically in 2D materials, but so far lacks experimental validation and investigation. Here, we present the experimental demonstration of 2D ferroelasticity in both exfoliated and chemical-vapor-deposited β’-In2Se3 down to few-layer thickness. We identify quantitatively 2D spontaneous strain originating from in-plane antiferroelectric distortion, using both atomic-resolution electron microscopy and in situ X-ray diffraction. The symmetry-equivalent strain orientations give rise to three domain variants separated by 60° and 120° domain walls (DWs). Mechanical switching between these ferroelastic domains is achieved under ≤0.5% external strain, demonstrating the feasibility to tailor the antiferroelectric polar structure as well as DW patterns through mechanical stimuli. The detailed domain switching mechanism through both DW propagation and domain nucleation is unraveled, and the effects of 3D stacking on such 2D ferroelasticity are also discussed. The observed 2D ferroelasticity here should be widely available in 2D materials with anisotropic lattice distortion, including the 1T’ transition metal dichalcogenides with Peierls distortion and 2D ferroelectrics such as the SnTe family, rendering tantalizing potential to tune 2D functionalities through strain or DW engineering.

Measuring the Blind Holes: Three-Dimensional Imaging of through Silicon via Using High Aspect Ratio AFM Probe

Three-dimensional integration and stacking of semiconductor devices with high density, its compactness, miniaturization and vertical 3D stacking of nanoscale devices highlighted many challenging problems in the 3D parameter’s such as CD (critical dimension) measurement, depth measurement of via holes, internal morphology of through silicon via (TSV), etc. Current challenge in the high-density 3D semiconductor devices is to measure the depth of through silicon via (TSV) without destructing the sample; TSVs are used in 3D stacking devices to connect the wafers stacked vertically to reduce the wiring delay, power dissipation, and of course, the form factor in the integration system. Special probes and algorithms have been designed to measure 3D parameters like wall roughness, sidewall angle, but these are only limited to deep trench-like structures and cannot be applied to structures like via holes and protrusions. To address these problems, we have proposed an algorithm based nondestructive 3D Atomic Force Microscopy (AFM). Using the high aspect ratio (5, 10, 20, 25) multiwall carbon nanotubes (MWCNTs) AFM probe, the depth of holes up to 1 micron is faithfully obtained. In addition to this, internal topography, side walls, and location of via holes are obtained faithfully. This atomic force microscopy technique enables to 3D scan the features (of any shape) present above and below the surface.

Microtexture Dependence of Mechanical and Electrical Properties of Gold Thin Films Used for Micro Bumps of 3D Stacking Structures

The variation of their crystallinity, in other words, the order of atom arrangement of grain boundaries in electroplated gold thin films was investigated by changing their manufacturing conditions. Then, the effect of the crystallinity on both their mechanical and electrical properties was measured by using nano-indentation test and electromigration test. The crystallinity of the gold thin films was varied by changing the under-layer material used for electroplating. Also, the micro texture of gold thin films was evaluated by EBSD (Electron Back-Scatter Diffraction) and XRD (X-Ray Diffraction). It was clarified that the crystallinity of the electroplated gold thin films changed drastically depending on the crystallinity of the under-layer materials and electroplating conditions such as current density and temperature. This variation of the crystallinity should have caused wide variation of mechanical properties of the films. In addition, their mechanical properties such as Young’s modulus and hardness showed wide variation by about 3 times comparing with those of bulk gold. Similarly, the EM resistance of the electroplated gold bumps varied drastically depending on the ratio of porous grain boundaries and their crystallinity. Both the ratio and crystallinity also varied depending on the crystallinity of the under layer and electroplating conditions. The effective lifetime of the gold bumps was successfully predicted by considering both the crystallinity and residual stress of fine gold bumps. The lifetime varied more than 10 times as a strong function of the crystallinity of grain boundaries in the fine bumps. Therefore, it is very important to control the crystallinity of the under-layer for electroplating in order to control the distribution of the mechanical properties and reliability of the electroplated gold thin films.