Encyclopedia of Packaging Materials, Processes, and Mechanics
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Published By World Scientific

9789811201110, 9789811209635, 9789811201158, 9789811209680
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Cu–Cu Direct Bonding

2019 ◽  
pp. 65-80
Author(s):  
KUAN-NENG CHEN

Design, Fabrication, and Characterization of Dense Compressible MicroInterconnects

2019 ◽  
pp. 105-121
Author(s):  
PAUL K. JO ◽  
MUNEEB ZIA ◽  
JOE L. GONZALEZ ◽  
HANJU OH ◽  
MUHANNAD S. BAKIR
Keyword(s):  
Fabrication And Characterization

Mechanically Flexible Interconnects (MFIs)

2019 ◽  
pp. 41-53
Author(s):  
CHAOQI ZHANG ◽  
MUHANNAD BAKIR

Design, Fabrication, and Assembly of 3-Arc-Fan Compliant Interconnects

2019 ◽  
pp. 1-20
Author(s):  
PHILIP Y. CHUNG ◽  
WEI CHEN ◽  
RAPHAEL I. OKEREKE ◽  
SURESH K. SITARAMAN

Wire Bond Substrates

2019 ◽  
pp. 311-352
Author(s):  
CHARLES ARVIN ◽  
DAVID J RUSSELL ◽  
HAILE WILSON
Keyword(s):  
Wire Bond

Progress in Processing and Properties of Fine Bonding Wires

2019 ◽  
pp. 205-255
Author(s):  
SARANGAPANI MURALI
Keyword(s):  
Bonding Wires

Wire Bonding Process

2019 ◽  
pp. 113-178
Author(s):  
IVY W. QIN
Keyword(s):  
Wire Bonding ◽  
Bonding Process

Electronic Packaging Technology

2019 ◽  
pp. 1-20
Author(s):  
PENGLI ZHU ◽  
DAOQIANG DANIEL LU ◽  
ZHUQING ZHANG ◽  
CHINGPING WONG
Keyword(s):  
Electronic Packaging ◽  
Packaging Technology
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