Electronic Packaging Technology

Encyclopedia of Packaging Materials, Processes, and Mechanics ◽

10.1142/9789811209659_0001 ◽

2019 ◽

pp. 1-20

Author(s):

PENGLI ZHU ◽

DAOQIANG DANIEL LU ◽

ZHUQING ZHANG ◽

CHINGPING WONG

Keyword(s):

Electronic Packaging ◽

Packaging Technology

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Reliability issues of Pb-free solder joints in electronic packaging technology

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) ◽

10.1109/ectc.2002.1008258 ◽

2003 ◽

Author(s):

K.N. Tu ◽

K. Zeng

Keyword(s):

Electronic Packaging ◽

Solder Joints ◽

Packaging Technology ◽

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Synchrotron Radiation Based X-ray Micro-Diffraction Study on Reliability Issues of Solder Joints in Electronic Packaging Technology

56th Electronic Components and Technology Conference 2006 ◽

10.1109/ectc.2006.1645924 ◽

2006 ◽

Author(s):

J.O. Suh ◽

J.W. Nah ◽

K.N. Tu ◽

N. Tamura

Keyword(s):

Synchrotron Radiation ◽

Diffraction Study ◽

Electronic Packaging ◽

Solder Joints ◽

Packaging Technology ◽

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2016 17th International Conference on Electronic Packaging Technology (ICEPT)

10.1109/icept38827.2016 ◽

2016 ◽

Keyword(s):

Electronic Packaging ◽

Packaging Technology ◽

International Conference

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2015 16th International Conference on Electronic Packaging Technology (ICEPT)

10.1109/icept36319.2015 ◽

2015 ◽

Keyword(s):

Electronic Packaging ◽

Packaging Technology ◽

International Conference

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2013 14th International Conference on Electronic Packaging Technology

10.1109/icept31628.2013 ◽

2013 ◽

Keyword(s):

Electronic Packaging ◽

Packaging Technology ◽

International Conference

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2010 11th International Conference on Electronic Packaging Technology & High Density Packaging

10.1109/icept-hdp17554.2010 ◽

2010 ◽

Keyword(s):

Electronic Packaging ◽

High Density ◽

Packaging Technology ◽

International Conference ◽

High Density Packaging

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2009 International Conference on Electronic Packaging Technology & High Density Packaging

10.1109/icept-hdp15675.2009 ◽

2009 ◽

Keyword(s):

Electronic Packaging ◽

High Density ◽

Packaging Technology ◽

International Conference ◽

High Density Packaging

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2019 20th International Conference on Electronic Packaging Technology(ICEPT)

10.1109/icept47577.2019 ◽

2019 ◽

Keyword(s):

Electronic Packaging ◽

Packaging Technology ◽

International Conference

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2017 18th International Conference on Electronic Packaging Technology (ICEPT)

10.1109/icept41821.2017 ◽

2017 ◽

Keyword(s):

Electronic Packaging ◽

Packaging Technology ◽

International Conference

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Reliability Study of Solder Joints in Electronic Packaging Technology

Harsh Environment Electronics ◽

10.1002/9783527813964.ch16 ◽

2019 ◽

pp. 345-365

Author(s):

Ahmed Sharif ◽

Sushmita Majumder

Keyword(s):

Electronic Packaging ◽

Solder Joints ◽

Reliability Study ◽

Packaging Technology

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