Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics
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12

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Published By Springer New York

9781441977588, 9781441977595

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Monolithic Carbonaceous Materials and Carbon Matrix Composites

Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-1-4419-7759-5_4 ◽

2010 ◽

pp. 169-200

Author(s):

Xingcun Colin Tong

Keyword(s):

Carbon Matrix ◽

Matrix Composites ◽

Carbonaceous Materials

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Thermal Management Fundamentals and Design Guides in Electronic Packaging

Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-1-4419-7759-5_1 ◽

2010 ◽

pp. 1-58 ◽

Author(s):

Xingcun Colin Tong

Keyword(s):

Thermal Management ◽

Electronic Packaging

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Thermoelectric Cooling Through Thermoelectric Materials

Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-1-4419-7759-5_11 ◽

2010 ◽

pp. 477-525 ◽

Author(s):

Xingcun Colin Tong

Keyword(s):

Thermoelectric Materials ◽

Thermoelectric Cooling

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Liquid Cooling Devices and Their Materials Selection

Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-1-4419-7759-5_10 ◽

2010 ◽

pp. 421-475 ◽

Author(s):

Xingcun Colin Tong

Keyword(s):

Materials Selection ◽

Liquid Cooling ◽

Cooling Devices

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Electronic Packaging Materials and Their Functions in Thermal Managements

Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-1-4419-7759-5_3 ◽

2010 ◽

pp. 131-167 ◽

Author(s):

Xingcun Colin Tong

Keyword(s):

Electronic Packaging ◽

Packaging Materials

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Development and Application of Advanced Thermal Management Materials

Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-1-4419-7759-5_12 ◽

2010 ◽

pp. 527-593 ◽

Author(s):

Xingcun Colin Tong

Keyword(s):

Thermal Management

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Thermal Interface Materials in Electronic Packaging

Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-1-4419-7759-5_8 ◽

2010 ◽

pp. 305-371 ◽

Author(s):

Xingcun Colin Tong

Keyword(s):

Electronic Packaging ◽

Thermal Interface Materials ◽

Thermal Interface ◽

Interface Materials

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Characterization Methodologies of Thermal Management Materials

Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-1-4419-7759-5_2 ◽

2010 ◽

pp. 59-129 ◽

Author(s):

Xingcun Colin Tong

Keyword(s):

Thermal Management

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Thermally Conductive Ceramic Matrix Composites

Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-1-4419-7759-5_7 ◽

2010 ◽

pp. 277-304 ◽

Author(s):

Xingcun Colin Tong

Keyword(s):

Ceramic Matrix Composites ◽

Ceramic Matrix ◽

Matrix Composites ◽

Thermally Conductive

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Thermally Conductive Polymer Matrix Composites

Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics ◽

10.1007/978-1-4419-7759-5_5 ◽

2010 ◽

pp. 201-232 ◽

Author(s):

Xingcun Colin Tong

Keyword(s):

Polymer Matrix ◽

Polymer Matrix Composites ◽

Conductive Polymer ◽

Matrix Composites ◽

Thermally Conductive

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