2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
Latest Publications

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Published By IEEE

9781479923151

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling

2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) ◽

10.1109/emccompo.2013.6735163 ◽

2013 ◽

Cited By ~ 1

Author(s):

Heegon Kim ◽

Jonghyun Cho ◽

Daniel H. Jung ◽

Jonghoon J. Kim ◽

Sumin Choi ◽

...

Keyword(s):

High Speed ◽

Differential Signaling

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Automatic conducted-EMI microcontroller model building

2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) ◽

10.1109/emccompo.2013.6735188 ◽

2013 ◽

Cited By ~ 1

Author(s):

Shih-Yi Yuan ◽

Shry-Sann Liao

Keyword(s):

Model Building ◽

Conducted Emi

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Study of radiated immunity of an electronic system in a reverberating chamber

2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) ◽

10.1109/emccompo.2013.6735176 ◽

2013 ◽

Cited By ~ 1

Author(s):

L. Guibert ◽

P. Millot ◽

X. Ferrieres ◽

E. Sicard

Keyword(s):

Electronic System

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Modeling and analysis of open defect in through silicon via (TSV) channel

2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) ◽

10.1109/emccompo.2013.6735193 ◽

2013 ◽

Cited By ~ 4

Author(s):

Daniel H. Jung ◽

Heegon Kim ◽

Jonghoon J. Kim ◽

Joungho Kim ◽

Hyun-Cheol Bae ◽

...

Keyword(s):

Through Silicon Via ◽

Modeling And Analysis ◽

Open Defect

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Impedance balance control for suppression of fluctuation on ground voltage in LSI package

2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) ◽

10.1109/emccompo.2013.6735187 ◽

2013 ◽

Cited By ~ 1

Author(s):

Masaaki Maeda ◽

Tohlu Matsushima ◽

Osami Wada

Keyword(s):

Balance Control

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Automatic verification of EMC immunity by simulation

2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) ◽

10.1109/emccompo.2013.6735201 ◽

2013 ◽

Cited By ~ 1

Author(s):

B. Vrignon ◽

P. Caunegre ◽

J. Shepherd ◽

Jianfei Wu

Keyword(s):

Automatic Verification

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IC-Stripline design optimization using response surface methodology

2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) ◽

10.1109/emccompo.2013.6735175 ◽

2013 ◽

Cited By ~ 7

Author(s):

Tvrtko Mandic ◽

Renaud Gillon ◽

Adrijan Baric

Keyword(s):

Response Surface Methodology ◽

Design Optimization ◽

Response Surface

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Evaluation of PDN impedance and power supply noise for different on-chip decoupling structures

2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) ◽

10.1109/emccompo.2013.6735189 ◽

2013 ◽

Cited By ~ 2

Author(s):

Haruya Fujita ◽

Hiroki Takatani ◽

Yosuke Tanaka ◽

Shohei Kawaguchi ◽

Masaomi Sato ◽

...

Keyword(s):

Power Supply ◽

Power Supply Noise ◽

Supply Noise ◽

On Chip

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Microcontroller emission simulation based on power consumption and clock system

2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) ◽

10.1109/emccompo.2013.6735197 ◽

2013 ◽

Author(s):

Thomas Steinecke

Keyword(s):

Power Consumption ◽

Clock System ◽

Simulation Based

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[Front matter]

2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) ◽

10.1109/emccompo.2013.6735160 ◽

2013 ◽

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2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling

Automatic conducted-EMI microcontroller model building

Study of radiated immunity of an electronic system in a reverberating chamber

Modeling and analysis of open defect in through silicon via (TSV) channel

Impedance balance control for suppression of fluctuation on ground voltage in LSI package

Automatic verification of EMC immunity by simulation

IC-Stripline design optimization using response surface methodology

Evaluation of PDN impedance and power supply noise for different on-chip decoupling structures

Microcontroller emission simulation based on power consumption and clock system

[Front matter]

2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
Latest Publications