Quality Improvement in Flexible Printed Circuit Board (FPCB) Using DMAIC Methodology: An Investigation in Semiconductor Industry

Continuous Process Improvement is methodology to solve the defect problem by increasing the effectiveness and efficiency of the business performances. DMAIC (Define-Measure-Analysis-Improve-Control) is a data improvement cycle designed for business process to find flaw or inefficiencies particularly resulting in defect or reject. This study was conducted at Company A and used DMAIC method to reduce the open defect for the circuit on the Flexible Printed Circuit Board (FPCB) from 0.6% to 0.3%. Part 13236 which has the highest open defect problem was chosen as the project improvement main focus. Imaging area was the main focus in this project because of its process forming the circuit. DMAIC methodology are initiated by problem identification through the past record of the open defect. The result observed for period of four months. After improvement, Part 13236 that have the highest defect decrease from 0.68% to 0.28% while the overall open defect decreases from 0.6% to 0.3%. The decline on product defect rate helps the company to improve the effectiveness and efficiency of business performances. It also results in cost saving which improves company’s profit margin in the long term.

Resistive Open Defect Isolation in Nano-Probing

In this paper, we present case studies of localizing resistive open defects using various FA techniques, including two-terminal IV, two-terminal Electron-Beam Absorbed Current (EBAC), Electron Beam Induced Resistance Change (EBIRCh), Pulsed IV, Capacitance-Voltage (CV) and Scanning Capacitance Microscopy (SCM). The advantage and limitation of each technique will also be discussed.