Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04)

Electrical conductive characteristics of ACA bonding: a review of the literature, current challenges and future prospects

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) ◽

10.1109/hpd.2004.1346710 ◽

2005 ◽

Author(s):

Guangbin Dou ◽

D.C. Whalley ◽

Changqing Liu

Keyword(s):

Review Of The Literature ◽

Future Prospects

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Design and implementation of system-on-package for radio and mixed-signal applications

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) ◽

10.1109/hpd.2004.1346680 ◽

2005 ◽

Cited By ~ 1

Author(s):

Li-Rong Zheng ◽

Xingzhong Duo ◽

Meigen Shen ◽

T. Torrika ◽

W. Michielsen ◽

...

Keyword(s):

Mixed Signal ◽

Design And Implementation

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Technology development and basic theory study of fluid dispensing - a review

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) ◽

10.1109/hpd.2004.1346698 ◽

2004 ◽

Cited By ~ 10

Author(s):

Li Jianping ◽

Deng Guiling

Keyword(s):

Technology Development ◽

Basic Theory ◽

Fluid Dispensing

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Micro-semiconductor tactile sensor for the automatic obstacle-avoidance system of endoscope

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) ◽

10.1109/hpd.2004.1346695 ◽

2004 ◽

Cited By ~ 2

Author(s):

Shen Linyong ◽

Qian Jinwu ◽

Zhang Zhen ◽

Zhang Yanan ◽

Yin Jinxi

Keyword(s):

Obstacle Avoidance ◽

Tactile Sensor

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Design and implementation of RS(255,223) decoder on FPGA

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) ◽

10.1109/hpd.2004.1346736 ◽

2004 ◽

Author(s):

Yan Laijin ◽

Li Ming

Keyword(s):

Design And Implementation

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Study of novel Schmitt-PPI circuit structure

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) ◽

10.1109/hpd.2004.1346683 ◽

2004 ◽

Author(s):

Wang Xiao-yun ◽

Zhang Jin-yi

Keyword(s):

Circuit Structure

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Packaging accuracy examination of the polarization-maintaining dual fiber collimator basing on machine sight

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) ◽

10.1109/hpd.2004.1346714 ◽

2004 ◽

Author(s):

Wang Zhi ◽

Qiu Jianxin

Keyword(s):

Fiber Collimator ◽

Polarization Maintaining

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Thermal-issues for design of high power SiC MESFETs

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) ◽

10.1109/hpd.2004.1346722 ◽

2004 ◽

Author(s):

W. Liu ◽

C.M. Zetterling ◽

M. Ostling

Keyword(s):

High Power

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Analysis & solution for the white-residue after soldering

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) ◽

10.1109/hpd.2004.1346697 ◽

2004 ◽

Author(s):

Zhe Liu ◽

Guang Yu Li ◽

Zhongzhong Jia ◽

Haoqiang Song

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Effects of contact metallizations on electrical resistance reliability of ACF interconnection for chip on flex application

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) ◽

10.1109/hpd.2004.1346711 ◽

2004 ◽

Cited By ~ 2

Author(s):

Jianhua Zhang ◽

Y.C. Chan

Keyword(s):

Electrical Resistance

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Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Electrical conductive characteristics of ACA bonding: a review of the literature, current challenges and future prospects

Design and implementation of system-on-package for radio and mixed-signal applications

Technology development and basic theory study of fluid dispensing - a review

Micro-semiconductor tactile sensor for the automatic obstacle-avoidance system of endoscope

Design and implementation of RS(255,223) decoder on FPGA

Study of novel Schmitt-PPI circuit structure

Packaging accuracy examination of the polarization-maintaining dual fiber collimator basing on machine sight

Thermal-issues for design of high power SiC MESFETs

Analysis & solution for the white-residue after soldering

Effects of contact metallizations on electrical resistance reliability of ACF interconnection for chip on flex application

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Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Electrical conductive characteristics of ACA bonding: a review of the literature, current challenges and future prospects

Design and implementation of system-on-package for radio and mixed-signal applications

Technology development and basic theory study of fluid dispensing - a review

Micro-semiconductor tactile sensor for the automatic obstacle-avoidance system of endoscope

Design and implementation of RS(255,223) decoder on FPGA

Study of novel Schmitt-PPI circuit structure

Packaging accuracy examination of the polarization-maintaining dual fiber collimator basing on machine sight

Thermal-issues for design of high power SiC MESFETs

Analysis & solution for the white-residue after soldering

Effects of contact metallizations on electrical resistance reliability of ACF interconnection for chip on flex application

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04)
Latest Publications