2019 IEEE International Integrated Reliability Workshop (IIRW)
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9781728122038
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scholarly journals RFID Tag Failure after Thermal Overstress

2019 ◽  
Author(s):  
Emre Ozturk ◽  
Mike J. Dikkers ◽  
Kevin M. Batenburg ◽  
Cora Salm ◽  
Jurriaan Schmitz
Keyword(s):  
Rfid Tag

Moisture Influence on Reliability and Electrical Characteristics of SiOC:H Low-k Dielectric Material

2019 ◽  
Author(s):  
Matthias Vidal-Dho ◽  
Quentin Hubert ◽  
Patrice Gonon ◽  
Bernard Pelissier ◽  
Pascal Fornara ◽  
...  
Keyword(s):  
Dielectric Material ◽  
Electrical Characteristics ◽  
Moisture Influence ◽  
Low K

TDDB in a Deuterated Low-k Interlayer Dielectric

2019 ◽  
Author(s):  
J. R. Lloyd ◽  
P. M. Lenahan ◽  
N. Mahmud ◽  
R. J. Waskiewicz
Keyword(s):  
Interlayer Dielectric ◽  
Low K

Impact of Mechanical Strain on 22 nm FDSOI Device Performance using Nanoindentation

2019 ◽  
Author(s):  
S. Schlipf ◽  
A. Clausner ◽  
J. Paul ◽  
S. Capecchi ◽  
G. Kurz ◽  
...  
Keyword(s):  
Mechanical Strain ◽  
Device Performance
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