3D Stacked Chips
Latest Publications

TOTAL DOCUMENTS

17

(FIVE YEARS 0)

H-INDEX

2

(FIVE YEARS 0)

Published By Springer International Publishing

9783319204802, 9783319204819

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Integrated Circuits for 3D Photonic Transceivers

3D Stacked Chips ◽

10.1007/978-3-319-20481-9_16 ◽

2016 ◽

pp. 297-308

Author(s):

Ronny Henker ◽

Guido Belfiore ◽

Laszlo Szilagyi ◽

Frank Ellinger

Keyword(s):

Integrated Circuits

Copper-Based TSV: Interposer

3D Stacked Chips ◽

10.1007/978-3-319-20481-9_2 ◽

2016 ◽

pp. 9-28 ◽

Cited By ~ 3

Author(s):

Sebastian Killge ◽

Volker Neumann ◽

Johann W. Bartha

Introduction to Electrical 3D Integration

3D Stacked Chips ◽

10.1007/978-3-319-20481-9_1 ◽

2016 ◽

pp. 3-7

Author(s):

Sebastian Killge ◽

Sujay Charania ◽

Johann W. Bartha

Keyword(s):

3D Integration

Integrated Optical Devices for 3D Photonic Transceivers

3D Stacked Chips ◽

10.1007/978-3-319-20481-9_13 ◽

2016 ◽

pp. 235-253 ◽

Cited By ~ 1

Author(s):

Seyedreza Hosseini ◽

Michael Haas ◽

Dirk Plettemeier ◽

Kambiz Jamshidi

Keyword(s):

Optical Devices ◽

Integrated Optical ◽

Integrated Optical Devices

Optical Through-Silicon Vias

3D Stacked Chips ◽

10.1007/978-3-319-20481-9_12 ◽

2016 ◽

pp. 221-234 ◽

Cited By ~ 4

Author(s):

Sebastian Killge ◽

Niels Neumann ◽

Dirk Plettemeier ◽

Johann W. Bartha

Keyword(s):

Through Silicon Vias ◽

Silicon Vias

Introduction to Optical Inter- and Intraconnects

3D Stacked Chips ◽

10.1007/978-3-319-20481-9_11 ◽

2016 ◽

pp. 213-220

Author(s):

Niels Neumann ◽

Ronny Henker ◽

Marcus S. Dahlem

Accurate Temperature Measurement for 3D Thermal Management

3D Stacked Chips ◽

10.1007/978-3-319-20481-9_8 ◽

2016 ◽

pp. 157-173

Author(s):

Sami ur Rehman ◽

Ayman Shabra

Keyword(s):

Temperature Measurement ◽

Thermal Management ◽

Accurate Temperature ◽

Accurate Temperature Measurement

Clock Generators for Heterogeneous MPSoCs Within 3D Chip Stacks

3D Stacked Chips ◽

10.1007/978-3-319-20481-9_6 ◽

2016 ◽

pp. 101-128

Author(s):

Sebastian Höppner ◽

Dennis Walter ◽

René Schüffny

Keyword(s):

Clock Generators

Athermal Photonic Circuits for Optical On-Chip Interconnects

3D Stacked Chips ◽

10.1007/978-3-319-20481-9_15 ◽

2016 ◽

pp. 283-295

Author(s):

Peng Xing ◽

Jaime Viegas

Keyword(s):

Photonic Circuits ◽

On Chip

Energy Efficient Electrical Intra-Chip-Stack Communication

3D Stacked Chips ◽

10.1007/978-3-319-20481-9_3 ◽

2016 ◽

pp. 29-67

Author(s):

Johannes Görner ◽

Dennis Walter ◽

Michael Haas ◽

Sebastian Höppner

Keyword(s):

Energy Efficient