IEEE Transactions on Components Hybrids and Manufacturing Technology
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Published By Institute Of Electrical And Electronics Engineers

1558-3082, 0148-6411
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Application of quality function deployment to the design of a lithium battery

1993 ◽  
Vol 16 (8) ◽  
pp. 802-807 ◽  
Author(s):  
L. Halbleib ◽  
P. Wormington ◽  
W. Cieslak ◽  
H. Street
Keyword(s):  
Quality Function Deployment ◽  
Lithium Battery ◽  
Quality Function

Thermal design for high-speed high-density multichip module

1993 ◽  
Vol 16 (4) ◽  
pp. 384-387 ◽  
Author(s):  
T. Handa ◽  
S. Iida ◽  
J. Utsunomiya
Keyword(s):  
High Speed ◽  
High Density ◽  
Thermal Design ◽  
Multichip Module

Thermal analysis of electrode heating and melting due to a spark

1993 ◽  
Vol 16 (4) ◽  
pp. 456-466 ◽  
Author(s):  
B.-J. Wang ◽  
N. Saka
Keyword(s):  
Thermal Analysis

Making contact to aged surfaces

1993 ◽  
Vol 16 (4) ◽  
pp. 424-430 ◽  
Author(s):  
R.D. Malucci

Surface mounting of very fine pitch components: a new challenge

1993 ◽  
Vol 16 (4) ◽  
pp. 402-406
Author(s):  
J. Joly ◽  
X. Saint-Martin
Keyword(s):  
Fine Pitch ◽  
Surface Mounting

Screening ICs on the bare chip level: temporary packaging

1993 ◽  
Vol 16 (4) ◽  
pp. 392-395
Author(s):  
D. Chu ◽  
C.A. Reber ◽  
D.W. Palmer

Packaging alternatives for high lead count, fine pitch, surface mount technology

1993 ◽  
Vol 16 (4) ◽  
pp. 396-401 ◽  
Author(s):  
R.J. Chroneos ◽  
D. Mallik ◽  
S.D. Prough
Keyword(s):  
Surface Mount Technology ◽  
Surface Mount ◽  
Fine Pitch ◽  
High Lead
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