Quality control in cyber-physical systems of smart electronics manufacturing

The creation of high-tech smart industries is observed in dynamically developing industries, which include the production of electronics and the automotive industry. The concept of “smart manufacturing” is closely related to the concept of cyber-physical systems, which integrates the main elements of digitalization and intellectualization. This concept provides for the continuous improvement of intellectual “cybernetic” resources for the effective management of the “physical” environment considered in this problem area. Improvement of technologies, ensuring high rates of reproducibility and suitability of equipment creates conditions for defect-free production. However, there remain the problems of recognizing patterns represented not by an obvious marriage, but by some not fully defined inconsistency on a set of requirements. The need to disclose uncertainties of this kind is typical for surface mounting technologies for printed circuit boards. The introduction of more and more advanced automatic optical inspections, containing the possibility of introducing intelligent (cybernetic) means, creates conditions for improving the quality of printed circuit boards as a “physical” environment. It is also important to minimize the “human factor”, the presence of which is still used when making decisions on the results of control. In the article, ensuring the rhythm of digital production and increasing the reliability of control in quality management in smart high-tech industries using the example of electronics production.

The Impact of Using Portable Sealer on Drop Out Component' Number at Surface Mounting Technology Production Line

The study aims to reduce the drop out of components that occur in the surface-mounting technology production line of PT. TEC Indonesia. This effort is carried out by designing a portable sealer product to glue the cover tape and carrier tape component products made in the line. In order to obtain the best value indicator for product design, this study uses a quantitative factorial design technique to determine value reduce drop out of components in the surface mounting technology (SMT) production of the parameter combination use of adhesive strength produced by the product. Information on study data obtained through the concept of experimental design (DOE) using temperature and treatment time parameters resulting from the product's design. Results of the tests have been carried out. Information on the adhesive strength reaches standard is rated at a temperature 1200 C for one two and three seconds, which can produce adhesion of 0.029 Kgf (the standard value is at 0.02-0.07 Kgf). In addition, the number of drop-out components produced after using the product has decreased significantly to zero, which previously reached an average of two to three components that were damaged or defective (test data).

In-mold lightweight integrating for structural/functional devices

Integration of function in structure is troublesome for structural/functional devices. A novel method of in-mold integrating for structural/functional devices was proposed and studied. In this method, a functional film was prepared by printing and surface mounting to achieve electrical functions, and then the film was formed and back molded into a final product. Owing to the complex electronic film, new problems are raised in the in-mold integrating process. The process was modeled, and was designed with the genetic algorithm. The interaction between the melt and the mounted film was analyzed by two-way fluid-structure coupling. Heat dissipation with anisotropic thermal conductivity was examined. Accordingly, a control panel was manufactured and tested. From the study, the functional film, causing asymmetrical cooling issue, results in concave warpage, which can be effectively controlled by comprehensive processing optimization. Film deformation is significant at button area because of tiny hollow structure. The deformation can be decreased by the epoxy encapsulation. The anisotropic thermal conductivity and injection layer cause heat dissipation problem, and thermal effect should be checked and designed by full thermal analysis. With the designed scheme, manufactured panels can perform all control functions, satisfy appearance requirements, and achieve lightweight performance.