Proceedings of the 2014 37th International Spring Seminar on Electronics Technology
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101

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Published By IEEE

9781479944552

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Development of a wafer-level integration technology for photonic transceivers based on planar lightwave circuits

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology ◽

10.1109/isse.2014.6887578 ◽

2014 ◽

Author(s):

Lukas Lorenz ◽

Sebastian Sohr ◽

Ralf Rieske ◽

Krzysztof Nieweglowski ◽

Thomas Zerna ◽

...

Keyword(s):

Wafer Level ◽

Planar Lightwave Circuits ◽

Integration Technology ◽

Planar Lightwave

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Galvanic plating for 3D-MID applications

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology ◽

10.1109/isse.2014.6887650 ◽

2014 ◽

Cited By ~ 1

Author(s):

Timo Kordass ◽

Jorg Franke

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Microelectronic circuits analogous to hydrogen bonding networks in Michaelis complex of beta-lactamase protein

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology ◽

10.1109/isse.2014.6887608 ◽

2014 ◽

Cited By ~ 2

Author(s):

Elitsa Gieva ◽

Rostislav Rusev ◽

George Angelov ◽

Rossen Radonov ◽

Marin Hristov

Keyword(s):

Hydrogen Bonding ◽

Beta Lactamase ◽

Hydrogen Bonding Networks

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Reliability of fine-line thick-film and LTCC conductors at high-temperature operation

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology ◽

10.1109/isse.2014.6887587 ◽

2014 ◽

Cited By ~ 2

Author(s):

Damian Nowak ◽

Andrzej Dziedzic

Keyword(s):

High Temperature ◽

Thick Film ◽

Fine Line ◽

High Temperature Operation

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Application of sensors and control microsystems to improve efficiency and service life durability of LED lighting equipment

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology ◽

10.1109/isse.2014.6887635 ◽

2014 ◽

Author(s):

Hristo Ivanov ◽

Marin Valkov

Keyword(s):

Service Life ◽

Led Lighting ◽

Improve Efficiency ◽

And Control

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Wireless energy transfer using resonant induction

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology ◽

10.1109/isse.2014.6887598 ◽

2014 ◽

Author(s):

Dan-Sebastian Filip ◽

Dorin Petreus

Keyword(s):

Energy Transfer ◽

Wireless Energy Transfer

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Received thermal images quality estimation in thermo vision communication systems

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology ◽

10.1109/isse.2014.6887614 ◽

2014 ◽

Author(s):

S. G. Pleshkova ◽

K. Hr. Peeva ◽

Al. Bekyarski

Keyword(s):

Communication Systems ◽

Quality Estimation ◽

Thermal Images

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Integration of microstrip LP and BP filters to multilayer structure based on various LTCC

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology ◽

10.1109/isse.2014.6887575 ◽

2014 ◽

Cited By ~ 1

Author(s):

Kornel Ruman ◽

Alena Pietrikova ◽

Igor Vehec ◽

Tibor Rovensky ◽

Pavol Galajda

Keyword(s):

Multilayer Structure

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Study of influence of thermal capacity and flux activity on the solderability

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology ◽

10.1109/isse.2014.6887589 ◽

2014 ◽

Cited By ~ 1

Author(s):

Karel Dusek ◽

Martin Placek ◽

David Busek ◽

Klara Dvorakova ◽

Alexandra Rudajevova

Keyword(s):

Thermal Capacity

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Employing model based failure mode and effect analysis for screen printing

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology ◽

10.1109/isse.2014.6887584 ◽

2014 ◽

Author(s):

Martin Molhanec ◽

Ivana Beshajova-Pelikanova

Keyword(s):

Failure Mode ◽

Screen Printing ◽

Effect Analysis ◽

Model Based

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Proceedings of the 2014 37th International Spring Seminar on Electronics TechnologyLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Development of a wafer-level integration technology for photonic transceivers based on planar lightwave circuits

Galvanic plating for 3D-MID applications

Microelectronic circuits analogous to hydrogen bonding networks in Michaelis complex of beta-lactamase protein

Reliability of fine-line thick-film and LTCC conductors at high-temperature operation

Application of sensors and control microsystems to improve efficiency and service life durability of LED lighting equipment

Wireless energy transfer using resonant induction

Received thermal images quality estimation in thermo vision communication systems

Integration of microstrip LP and BP filters to multilayer structure based on various LTCC

Study of influence of thermal capacity and flux activity on the solderability

Employing model based failure mode and effect analysis for screen printing

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology
Latest Publications