2007 International Symposium on Semiconductor Manufacturing
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TOTAL DOCUMENTS

120

(FIVE YEARS 0)

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5

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Published By IEEE

9781424411412

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Yield prediction techniques based on DFM rules and criticality for 65nm technology and beyond

2007 International Symposium on Semiconductor Manufacturing ◽

10.1109/issm.2007.4446785 ◽

2007 ◽

Author(s):

Tsutomu Kojima ◽

S. Kyou ◽

H. Murakami ◽

K. Honda ◽

T. Nakayama ◽

...

Keyword(s):

Yield Prediction ◽

Prediction Techniques

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Using electrostatic repulsion to prevent adhesion of infinitesimal particles

2007 International Symposium on Semiconductor Manufacturing ◽

10.1109/issm.2007.4446896 ◽

2007 ◽

Author(s):

Junji Oikawa ◽

Terumi Yamashita ◽

Hidefumi Matsui ◽

Akitake Tamura ◽

Teruyuki Hayashi

Keyword(s):

Electrostatic Repulsion

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Yield characterization of high-current ion implantation particles on 65 nm CMOS transistors

2007 International Symposium on Semiconductor Manufacturing ◽

10.1109/issm.2007.4446889 ◽

2007 ◽

Author(s):

Brian Whitson ◽

Aaron Vanderpool

Keyword(s):

Ion Implantation ◽

High Current ◽

Cmos Transistors

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Development of a high efficiency PFC abatement system utilizing plasma and Ca(OH)2/CaO under a decompression atmosphere

2007 International Symposium on Semiconductor Manufacturing ◽

10.1109/issm.2007.4446796 ◽

2007 ◽

Author(s):

K. Suzuki ◽

Y. Ishihara ◽

K. Sakoda ◽

Y. Shirai ◽

M. Hirayama ◽

...

Keyword(s):

High Efficiency

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300mm prime gaps that need to be addressed to boost productivity

2007 International Symposium on Semiconductor Manufacturing ◽

10.1109/issm.2007.4446821 ◽

2007 ◽

Author(s):

Les Marshall ◽

Kristin Rust ◽

Kilian Schmidt

Keyword(s):

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Clean room Airborne Molecular Contamination (AMC) on damascene Cu interconnects

2007 International Symposium on Semiconductor Manufacturing ◽

10.1109/issm.2007.4446892 ◽

2007 ◽

Author(s):

Bill Brennan ◽

Kin Sang Lam ◽

Pete Beckage ◽

Bryon Hance

Keyword(s):

Cu Interconnects

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Localized TDDB failures related to STI corner profile in advanced embedded high voltage CMOS technologies for power management units

2007 International Symposium on Semiconductor Manufacturing ◽

10.1109/issm.2007.4446865 ◽

2007 ◽

Author(s):

Yee Ming Chan ◽

Chin Boon Moey ◽

Hing Poh Kuan

Keyword(s):

Power Management ◽

High Voltage ◽

Management Units

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Application of robust design for the tuning of resistance-temperature characteristics in diodes

2007 International Symposium on Semiconductor Manufacturing ◽

10.1109/issm.2007.4446843 ◽

2007 ◽

Author(s):

N. Kuramochi ◽

K. Mochiduki ◽

M. Tsuchitani

Keyword(s):

Robust Design ◽

Temperature Characteristics

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A sensitive technique to enable technology transfer and fab matching in deep sub-micron technologies

2007 International Symposium on Semiconductor Manufacturing ◽

10.1109/issm.2007.4446836 ◽

2007 ◽

Author(s):

Bin Wang ◽

Ron Paulsen

Keyword(s):

Technology Transfer ◽

Sensitive Technique

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PVD TiN hardmask for copper metallization

2007 International Symposium on Semiconductor Manufacturing ◽

10.1109/issm.2007.4446856 ◽

2007 ◽

Author(s):

Zhigang Xie ◽

Ashish Bodke ◽

Jianming Fu ◽

Rahul Jauhari ◽

Magdy Abdelrahman

Keyword(s):

Copper Metallization

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