2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)

Aspects of data reception in a high performance RFID reader

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2013.6743656 ◽

2013 ◽

Cited By ~ 3

Author(s):

Dan Tudor Vuza ◽

Reinhold Frosch ◽

Helmut Koeberl ◽

Marian Vladescu

Keyword(s):

High Performance ◽

Rfid Reader

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Comparative analysis of two digital control algorithms for a DC-DC converter

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2013.6743654 ◽

2013 ◽

Cited By ~ 1

Author(s):

C. Orian ◽

D. Petreus ◽

R. Etz ◽

T. Patarau

Keyword(s):

Comparative Analysis ◽

Digital Control ◽

Control Algorithms

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Thermal modelling of IC packages

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2013.6743662 ◽

2013 ◽

Author(s):

Alexandra Fodor ◽

Rajmond Jano

Keyword(s):

Thermal Modelling

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The experimental stand for the study of the hydro wind hybrid power stations

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2013.6743663 ◽

2013 ◽

Author(s):

R. Joian ◽

D. Petreus ◽

R. Etz ◽

C. Lung

Keyword(s):

Hybrid Power ◽

Power Stations ◽

Experimental Stand

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Optimal microheater Patterns with PEDOT:PSS conductors for flexible sensor applications

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2013.6743643 ◽

2013 ◽

Author(s):

C. Ionescu ◽

N. D. Codreanu ◽

P. Svasta ◽

D. Bonfert

Keyword(s):

Flexible Sensor ◽

Sensor Applications

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Factors influencing the formation of voids in chip component solder joints

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2013.6743690 ◽

2013 ◽

Author(s):

Mihaela Pantazica ◽

Paul Svasta ◽

Heinz Wohlrabe ◽

Klaus-Jurgen Wolter

Keyword(s):

Solder Joints ◽

Factors Influencing

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Differential power analysis: Simulated versus experimental attacks

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2013.6743668 ◽

2013 ◽

Author(s):

Ciprian Leonard Pitu ◽

Radu Campeanu

Keyword(s):

Power Analysis ◽

Differential Power Analysis

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Investigating hole filling in pin-in-paste technology for vapour phase soldering

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2013.6743644 ◽

2013 ◽

Author(s):

Reka Batorfi ◽

Richard Storcz ◽

Miklos Ruszinko

Keyword(s):

Vapour Phase ◽

Hole Filling

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Soldering tests with biodegradable printed circuit boards

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2013.6743641 ◽

2013 ◽

Cited By ~ 4

Author(s):

A. Geczy ◽

T. Garami ◽

B. Kovacs ◽

D. Nagy ◽

L. Gal ◽

...

Keyword(s):

Printed Circuit Boards ◽

Circuit Boards ◽

Printed Circuit

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EDLC hybrid system with increased lifespan for supplying an UPS

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2013.6743682 ◽

2013 ◽

Cited By ~ 6

Author(s):

Alexandru Vasile ◽

Cristina Marghescu

Keyword(s):

Hybrid System

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2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Aspects of data reception in a high performance RFID reader

Comparative analysis of two digital control algorithms for a DC-DC converter

Thermal modelling of IC packages

The experimental stand for the study of the hydro wind hybrid power stations

Optimal microheater Patterns with PEDOT:PSS conductors for flexible sensor applications

Factors influencing the formation of voids in chip component solder joints

Differential power analysis: Simulated versus experimental attacks

Investigating hole filling in pin-in-paste technology for vapour phase soldering

Soldering tests with biodegradable printed circuit boards

EDLC hybrid system with increased lifespan for supplying an UPS

Export Citation Format

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Aspects of data reception in a high performance RFID reader

Comparative analysis of two digital control algorithms for a DC-DC converter

Thermal modelling of IC packages

The experimental stand for the study of the hydro wind hybrid power stations

Optimal microheater Patterns with PEDOT:PSS conductors for flexible sensor applications

Factors influencing the formation of voids in chip component solder joints

Differential power analysis: Simulated versus experimental attacks

Investigating hole filling in pin-in-paste technology for vapour phase soldering

Soldering tests with biodegradable printed circuit boards

EDLC hybrid system with increased lifespan for supplying an UPS

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)
Latest Publications