18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Comparisons of mechanical reliabilities of Sn-3.0Ag-0.5Cu solder between ENIG and immersion Sn pad finishes

18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2011.5992741 ◽

2011 ◽

Author(s):

Jae-Myeong Kim ◽

Myeong-Hyeok Jeong ◽

Sang-Hyun Kwon ◽

Sehoon Yoo ◽

Young-Bae Park

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Photographic distinction of defects in multicrystalline Si by spectroscopic electroluminescence

18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2011.5992758 ◽

2011 ◽

Author(s):

Kohei Kudo ◽

Hiroyoshi Suzuki ◽

Toru Matsumoto ◽

Emi Sugimura ◽

Ayumi Tani ◽

...

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Non-ideal characteristic analysis of GaN-based light-emitting diode using current-voltage (I–V) and low-frequency noise experiment

18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2011.5992713 ◽

2011 ◽

Author(s):

Jungjin Park ◽

Taewook Kang ◽

Daeyoung Woo ◽

Joong-Kon Son ◽

Jong-Ho Lee ◽

...

Keyword(s):

Light Emitting Diode ◽

Low Frequency ◽

Frequency Noise ◽

Low Frequency Noise ◽

Characteristic Analysis ◽

Light Emitting ◽

Current Voltage ◽

Noise Experiment

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The effect of SiO2/SiNx bilayer structure on the bias and light-induced instability in InGaZnO TFTs

18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2011.5992716 ◽

2011 ◽

Author(s):

Kwang Hwan Ji ◽

Ji-In Kim ◽

Hong Yoon Jung ◽

Se Yeob Park ◽

Yeon-Gon Mo ◽

...

Keyword(s):

Bilayer Structure

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Application of X-Ray MicroCT for non-destructive failure analysis and package construction characterization

18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2011.5992732 ◽

2011 ◽

Cited By ~ 6

Author(s):

Morgan Cason ◽

Raleigh Estrada

Keyword(s):

Failure Analysis ◽

X Ray ◽

Non Destructive

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Non-destructive mechanical characterization of metal to metal bond interface for 3D-ICs

18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2011.5992797 ◽

2011 ◽

Author(s):

Riko I Made ◽

Chee Lip Gan

Keyword(s):

Mechanical Characterization ◽

Metal Bond ◽

3D Ics ◽

Bond Interface ◽

Non Destructive

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Stress induced self aligned contact failure during tungsten-poly gate process in sub-60 nm memory device

18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2011.5992764 ◽

2011 ◽

Author(s):

Min-Gyu Sung ◽

Yong Soo Kim ◽

Sung-Ki Park

Keyword(s):

Memory Device ◽

Contact Failure

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On-chip LDO voltage regulator failure analysis and yield improvement

18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2011.5992748 ◽

2011 ◽

Author(s):

Re-Long Chiu ◽

Jason Higgins ◽

Shu-Lan Ying ◽

Gang Wang ◽

Quincy Chiu ◽

...

Keyword(s):

Failure Analysis ◽

Voltage Regulator ◽

Yield Improvement ◽

On Chip

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Whitening phenomena between polyphthalamide sidewall and silicone encapsulant in the light-emitting diode package

18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2011.5992729 ◽

2011 ◽

Author(s):

Kwang-Cheol Lee ◽

Sang-Mook Kim ◽

Hwa-Sub Oh ◽

Jong Hyeob Baek

Keyword(s):

Light Emitting Diode ◽

Light Emitting

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Metal pad failure phenomena of biosensor due to spontaneous nickel silicide formation

18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2011.5992763 ◽

2011 ◽

Author(s):

Boung Ju Lee ◽

Jae Sub Oh ◽

Seok Jae Lee

Keyword(s):

Nickel Silicide ◽

Silicide Formation

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18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Comparisons of mechanical reliabilities of Sn-3.0Ag-0.5Cu solder between ENIG and immersion Sn pad finishes

Photographic distinction of defects in multicrystalline Si by spectroscopic electroluminescence

Non-ideal characteristic analysis of GaN-based light-emitting diode using current-voltage (I–V) and low-frequency noise experiment

The effect of SiO2/SiNx bilayer structure on the bias and light-induced instability in InGaZnO TFTs

Application of X-Ray MicroCT for non-destructive failure analysis and package construction characterization

Non-destructive mechanical characterization of metal to metal bond interface for 3D-ICs

Stress induced self aligned contact failure during tungsten-poly gate process in sub-60 nm memory device

On-chip LDO voltage regulator failure analysis and yield improvement

Whitening phenomena between polyphthalamide sidewall and silicone encapsulant in the light-emitting diode package

Metal pad failure phenomena of biosensor due to spontaneous nickel silicide formation

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18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Comparisons of mechanical reliabilities of Sn-3.0Ag-0.5Cu solder between ENIG and immersion Sn pad finishes

Photographic distinction of defects in multicrystalline Si by spectroscopic electroluminescence

Non-ideal characteristic analysis of GaN-based light-emitting diode using current-voltage (I–V) and low-frequency noise experiment

The effect of SiO2/SiNx bilayer structure on the bias and light-induced instability in InGaZnO TFTs

Application of X-Ray MicroCT for non-destructive failure analysis and package construction characterization

Non-destructive mechanical characterization of metal to metal bond interface for 3D-ICs

Stress induced self aligned contact failure during tungsten-poly gate process in sub-60 nm memory device

On-chip LDO voltage regulator failure analysis and yield improvement

Whitening phenomena between polyphthalamide sidewall and silicone encapsulant in the light-emitting diode package

Metal pad failure phenomena of biosensor due to spontaneous nickel silicide formation

18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Latest Publications