18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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Comparisons of mechanical reliabilities of Sn-3.0Ag-0.5Cu solder between ENIG and immersion Sn pad finishes

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Sang-Hyun Kwon ◽  
Sehoon Yoo ◽  
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Photographic distinction of defects in multicrystalline Si by spectroscopic electroluminescence

2011 ◽  
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The effect of SiO2/SiNx bilayer structure on the bias and light-induced instability in InGaZnO TFTs

2011 ◽  
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Kwang Hwan Ji ◽  
Ji-In Kim ◽  
Hong Yoon Jung ◽  
Se Yeob Park ◽  
Yeon-Gon Mo ◽  
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Bilayer Structure

On-chip LDO voltage regulator failure analysis and yield improvement

2011 ◽  
Author(s):  
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Failure Analysis ◽  
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On Chip
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