Application of X-Ray MicroCT for non-destructive failure analysis and package construction characterization

2011 ◽  
Author(s):  
Morgan Cason ◽  
Raleigh Estrada
Keyword(s):  
Failure Analysis ◽  
X Ray ◽  
Non Destructive

Applications of 3D X-Ray Microscopy for Advanced Package Development

2011 ◽  
Vol 2011 (1) ◽  
pp. 001078-001083 ◽  
Author(s):  
K. Fahey ◽  
R. Estrada ◽  
L. Mirkarimi ◽  
R. Katkar ◽  
D. Buckminster ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Flip Chip ◽  
Development Stage ◽  
Development Effort ◽  
X Ray ◽  
Structural Details ◽  
Volumetric Images ◽  
Advanced Packaging ◽  
Solder Fatigue ◽  
Non Destructive

This paper describes the utilization of non-destructive imaging using 3D x-ray microscopy for package development and failure analysis. Four case studies are discussed to explain our methodology and its impact on our advanced packaging development effort. Identifying and locating failures embedded deep inside the package, such as a solder fatigue failure within a flip chip package, without the need for physical cross-sectioning is of substantial benefit because it preserves the package for further analysis. Also of utility is the ability to reveal the structural details of the package while producing superior quality 2D and volumetric images. The technique could be used not only for analysis of defects and failures, but also to characterize geometries and morphologies during the process and package development stage.

Failure analysis of epoxy molded IC packages

2016 ◽  
Vol 33 (2) ◽  
pp. 94-101
Author(s):  
Kamil Janeczek ◽  
Aneta Arazna ◽  
Konrad Futera ◽  
Grazyna Koziol
Keyword(s):  
Failure Analysis ◽  
Sulphuric Acid ◽  
Electronic Devices ◽  
Mechanical Grinding ◽  
Content Type ◽  
Power Mosfets ◽  
X Ray ◽  
Non Destructive ◽  
Practical Implications ◽  
Graphic Software

Purpose The aim of this paper is to present non-destructive and destructive methods of failure analysis of epoxy moulded IC packages on the example of power MOSFETs in SOT-227 package. Design/methodology/approach A power MOSFET in SOT-227 package was examined twice using X-ray inspection, at first as the whole component to check if it is damaged and then after removing the upper part of package by mechanical grinding. The purpose of the second X-ray inspection was to prepare images for estimation of the total number and approximate location of voids in soft solder layers. Finally, power MOSFETs were subjected to decapsulation process using a concentrated sulphuric acid to verify existence of damage areas noticed during X-ray analysis and to observe other possible failures such as cracks in aluminium metallization or wires deformation. Findings X-ray analysis was revealed to be adequate technique to detect damage (e.g. meltings) in power MOSFETs in SOT-227 package, but only when tested components were analysed in the side view. This type of analysis combined with a graphic software is also suitable for voids estimation in soft solder layers. Moreover, it was found that a single acid (concentrated sulphuric acid) at elevated temperature can be successfully used for decapsulation of power MOSFETs in SOT-227 package without damage of aluminium metallization and aluminium wires. Such decapsulation process enables analysis of defects in wire, die and package materials. Research limitations/implications Further investigations are required to examine if the presented methods of failures analysis can be used for other types of components (e.g. high power resistors) in similar packages. Practical/implications The described methods of failure analysis can find application in electronic industry to select components which are free of damage and in effect which allow to produce high reliable devices. Apart from it, the presented method is applicable to evaluate reasons of improper work of tested electronic devices and to identify faked components. Originality/value This paper contains valuable information for research and technical staff involved in the assessment of electronic devices who needs practical methods of failure analysis of epoxy moulded IC packages.

Failure Analysis of a Qualification Unit Injector for a Satellite Thruster

1998 ◽  
Author(s):  
M. Lipschutz ◽  
R. Brannam ◽  
T. Nguyentat
Keyword(s):  
Failure Analysis ◽  
Cross Section ◽  
Combustion Products ◽  
Design Parameters ◽  
Cross Sectional ◽  
X Ray ◽  
Root Cause ◽  
Qualification Testing ◽  
Non Destructive ◽  
Unit Injector

Abstract This article details the results of a failure analysis performed on a Qualification Unit injector for a military satellite thrusters and explains that the failure was initially detected due to a shift in performance during qualification testing. Failure analysis involved non-destructive evaluation on the injector using micro-focus X-ray and scanning electron microscopy. Serial cross-sectional metallography was then performed, with each cross-section documented by optical microscopy and SEM. The failure analysis resulted in three main conclusions: (1) the root cause of the failure was attributed to multiple detonations in or around the damaged orifice; these detonations were likely caused by fuel and/or combustion products condensing in the orifice between pulses and then igniting during a subsequent pulse; (2) multiple damage mechanisms were identified in addition to the ZOT detonations; and (3) the material and platelet manufacturing process met all design parameters.

Application to Non Destructive Physical Analysis Method Using X-ray CT Imaging

2010 ◽  
Author(s):  
Akira Mizoguchi ◽  
Minoru Sugawara ◽  
Masahide Nakamura ◽  
Koichiro Takeuchi
Keyword(s):  
Failure Analysis ◽  
Three Dimensional ◽  
Ct Imaging ◽  
Temperature Cycling ◽  
Physical Analysis ◽  
Printed Wiring Boards ◽  
X Ray ◽  
X Ray Imaging ◽  
X Ray Computed ◽  
Non Destructive

Abstract We have been paying attention to the development of the nondestructive physical analysis (NDPA) technology. We think that NDPA is a technology which doesn't depend on the worker's capability or experience. There are many NDPA techniques, and analysis using X-ray imaging is one of the principal techniques. Due to the progress of the image analysis using computers in recent years, X-ray imaging have been evolving from two dimensional images to three dimensional imaging. We have been applying X-ray CT imaging to actual failure analysis and reliability evaluation since 2008. At ISTFA 2009, we reported on the effectiveness of X-ray Computed Tomography (CT) images in the failure analysis. [1] We confirmed that the X-ray CT image had various applications, for example, screening for counterfeit parts, the detection of the defect of the multi-layers printed wiring boards (multi-layers PWB), the structure confirmation of caulking contacts, and the detection of cracks or voids of the solder joint. This paper discusses the effectiveness of X-ray CT imaging in failure analysis and discusses the effectiveness of applying X-ray CT imaging to the propagation of cracks occurring at solder joints during temperature cycling test.

Modern 2D & 3D X-ray Technologies for Testing and Failure Analysis

2019 ◽  
Author(s):  
Herminso Villaraga-Gómez ◽  
Joshua D. Bell
Keyword(s):  
Failure Analysis ◽  
Non Destructive Testing ◽  
Dimensional Metrology ◽  
Destructive Testing ◽  
X Ray ◽  
Advantages And Disadvantages ◽  
Computed Laminography ◽  
Basic Operating ◽  
2D And 3D ◽  
Non Destructive

Abstract Modern 2D and 3D X-ray technologies are among the most useful non-destructive testing methods that enable the inspection of an object's internal features without cutting or disassembling the sample. This paper discusses the basic operating principle, advantages, and disadvantages of 2D and 3D X-ray based approaches for testing and failure analysis and describes how these different methods have practical application for failure analysis and dimensional metrology. The techniques discussed are radiography, classical laminography, computed tomography, and computed laminography.

Development of Advanced Non Destructive Techniques for Failure Analysis of PCBs and PCBAs

2012 ◽  
Author(s):  
Julien Perraud ◽  
Shaïma Enouz-Vedrenne ◽  
Jean-Claude Clement ◽  
Arnaud Grivon
Keyword(s):  
Failure Analysis ◽  
Printed Circuit Board ◽  
Acoustic Microscopy ◽  
Circuit Board ◽  
Printed Circuit Board Assembly ◽  
X Ray ◽  
Printed Circuit ◽  
Advanced Analysis ◽  
Non Destructive ◽  
Non Destructive Techniques

Abstract The continuous miniaturization trends followed by a vast majority of electronic applications results in always denser PCBs (Printed Circuit Board) designs and PCBAs (Printed Circuit Board Assembly) with increasing solder joint densities. Current high-end designs feature high layer count sequential build-up PCBs with fine lines/spaces and numerous stacked filled microvias, as well as closely spaced BGA/QFN components with pitches down to 0.4mm. In recent years, several 3D packaging approaches have emerged to further increase system integration by enabling the stacking of several dies or packages. This has translated for example into the advent of highly integrated complex System in Package (SiP) modules, Package-on-Package (PoP) assemblies or chips embedded in PCBs [1]. From a failure analysis (FA) perspective, this deep technology evolution is setting extreme challenges for accurately locating a failure site, especially when destructive techniques are not desired. The few conventional non-destructive techniques like optical or x-ray inspection are now practically becoming useless for high density PCB designs. This paper reviews several advanced analysis techniques that could be used to overcome these limitations. It will be shown through several examples how three non-destructive methods usually dedicated to package analyses can be efficiently adapted to PCBs and PCBAs: • Scanning Acoustic Microscopy (SAM) • 3D X-ray Computed Tomography (CT) • Infrared Thermography A case study of a flex-rigid board FA is presented to show the efficiency of these three techniques over classical techniques. In this example, not only the defect localization has been possible, but also the defect characterization without using destructive analysis.

Nondestructive Analysis Solution Using Combination of Lock-In Thermography (LIT) and 3D Oblique X-Ray CT Technology

2013 ◽  
Author(s):  
Naoki Seimiya ◽  
Takuhei Watanabe ◽  
Takashi Ichinomiya
Keyword(s):  
High Resolution ◽  
Failure Analysis ◽  
Analysis Method ◽  
Nondestructive Analysis ◽  
X Ray ◽  
Ct Technology ◽  
Total Analysis ◽  
Lock In ◽  
Type Of Failure ◽  
Non Destructive

Abstract We developed the non-destructive failure analysis method that is combination of Lock-in thermography (LIT) and high resolution 3D oblique CT. It made possible to complete the total analysis efficiently, because we can distinguish the type of failure by this non-destructive method.

X-ray Fluorescence Imaging for High Resolution Elemental Mapping

2005 ◽  
Author(s):  
M. Feser ◽  
W. Yun ◽  
A. Lyon ◽  
Y. Wang ◽  
S. Sehadri
Keyword(s):  
Failure Analysis ◽  
Fluorescence Imaging ◽  
Semiconductor Manufacturing ◽  
Nondestructive Inspection ◽  
Copper Interconnects ◽  
Elemental Mapping ◽  
X Ray ◽  
Wide Range ◽  
Elemental Maps ◽  
Non Destructive

Abstract X-ray fluorescence imaging is a novel non-destructive method to obtain sub-100nm spatial resolution elemental maps with short data acquisition times. The method has a wide range of applicability in the field of semiconductor manufacturing and semiconductor failure analysis. Imaging of copper interconnects on ICs for the location of voids and shorts is one particular application that is relevant for current and future needs of nondestructive inspection and failure analysis of backend processes.

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