[1992 Proceedings] Electrical Performance of Electronic Packaging
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57

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078030683x

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Design of controlled slew rate CMOS output driver and optimum package-pin placement to minimize the "effective" power/ground switching noise

[1992 Proceedings] Electrical Performance of Electronic Packaging ◽

10.1109/epep.1992.572252 ◽

2005 ◽

Author(s):

R. Senthinathan ◽

J.L. Prince

Keyword(s):

Switching Noise ◽

Slew Rate ◽

Effective Power ◽

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Optical interconnects for electronic systems at the board level of packaging

[1992 Proceedings] Electrical Performance of Electronic Packaging ◽

10.1109/epep.1992.572257 ◽

2005 ◽

Author(s):

R.K. Kostuk

Keyword(s):

Optical Interconnects ◽

Electronic Systems ◽

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EMI prediction using a full-wave analysis method based on a surface formulation

[1992 Proceedings] Electrical Performance of Electronic Packaging ◽

10.1109/epep.1992.572302 ◽

2005 ◽

Author(s):

S. Ponnapalli ◽

H. Heeb

Keyword(s):

Analysis Method ◽

Wave Analysis ◽

Full Wave ◽

Full Wave Analysis

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New EMC design guidelines for multilayer printed wiring boards

[1992 Proceedings] Electrical Performance of Electronic Packaging ◽

10.1109/epep.1992.572280 ◽

2005 ◽

Author(s):

T.H. Hubing ◽

T.P. Van Doren

Keyword(s):

Design Guidelines ◽

Printed Wiring Boards ◽

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Freuency-dependent transmission line parameters

[1992 Proceedings] Electrical Performance of Electronic Packaging ◽

10.1109/epep.1992.572284 ◽

2005 ◽

Author(s):

D.F. Willaims ◽

R.B. Marka

Keyword(s):

Transmission Line

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Frequency dependent characterizaton of a microstrip line over a perforated ground plane

[1992 Proceedings] Electrical Performance of Electronic Packaging ◽

10.1109/epep.1992.572273 ◽

2005 ◽

Author(s):

M. Kahrizi ◽

T.K. Sarkar ◽

Z.A. Maricevic

Keyword(s):

Microstrip Line ◽

Ground Plane ◽

Frequency Dependent

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Time domain characterization of dispersive dissipative interconnects

[1992 Proceedings] Electrical Performance of Electronic Packaging ◽

10.1109/epep.1992.572295 ◽

2005 ◽

Author(s):

V.K. Tripathi ◽

N. Orhanovic

Keyword(s):

Time Domain ◽

Time Domain Characterization

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Automating design for signal integrity

[1992 Proceedings] Electrical Performance of Electronic Packaging ◽

10.1109/epep.1992.572251 ◽

2005 ◽

Author(s):

P. Franson ◽

S. Mehrotra ◽

S. Simovich ◽

M. Steer

Keyword(s):

Signal Integrity

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Circuit modeling of high speed packages from TDR/T measurements

[1992 Proceedings] Electrical Performance of Electronic Packaging ◽

10.1109/epep.1992.572292 ◽

2005 ◽

Author(s):

J.M. Jong ◽

V.K. Tripathi ◽

B. Janko ◽

D.H. Smith

Keyword(s):

Circuit Modeling

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Practical packaging constraints and intra-computer optical interconnections

[1992 Proceedings] Electrical Performance of Electronic Packaging ◽

10.1109/epep.1992.572260 ◽

2005 ◽

Author(s):

M.B. Ritter

Keyword(s):

Optical Interconnections

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