New EMC design guidelines for multilayer printed wiring boards

Author(s):  
T.H. Hubing ◽  
T.P. Van Doren
2017 ◽  
Vol 139 (3) ◽  
Author(s):  
Jingshi Meng ◽  
Abhijit Dasgupta

Portable electronic devices are commonly exposed to shock and impact loading due to accidental drops. After external impact, internal collisions (termed “secondary impacts” in this study) between vibrating adjacent subassemblies of a product may occur if design guidelines fail to prevent such events. Secondary impacts can result in short acceleration pulses with much higher amplitudes and higher frequencies than those in conventional board-level drop tests. Thus, such pulses are likely to excite the high-frequency resonances of printed wiring boards (PWBs) (including through-thickness “breathing” modes) and also of miniature structures in assembled surface mount technology (SMT) components. Such resonant effects have a strong potential to damage the component, and therefore should be avoided. When the resonant frequency of a miniature structure (e.g., elements of an SMT microelectromechanical system (MEMS) component) in an SMT assembly is close to a natural frequency of the PWB, an amplified response is expected in the miniature structure. Components which are regarded as reliable under conventional qualification test methods may still pose a failure risk when secondary impact is considered. This paper is the second part of a two-part series exploring the effect of secondary impacts in a printed wiring assembly (PWA). The first paper is this series focused on the breathing mode of vibration generated in a PWB under secondary impact, and this paper focuses on analyzing the effect of such breathing modes on typical failure modes with different resonant frequencies in SMT applications. The results demonstrate distinctly different sensitivity of each failure mode to the impacts.


PCI Journal ◽  
2020 ◽  
Vol 65 (6) ◽  
pp. 35-61
Author(s):  
Chungwook Sim ◽  
Maher Tadros ◽  
David Gee ◽  
Micheal Asaad

Ultra-high-performance concrete (UHPC) is a special concrete mixture with outstanding mechanical and durability characteristics. It is a mixture of portland cement, supplementary cementitious materials, sand, and high-strength, high-aspect-ratio microfibers. In this paper, the authors propose flexural design guidelines for precast, prestressed concrete members made with concrete mixtures developed by precasters to meet minimum specific characteristics qualifying it to be called PCI-UHPC. Minimum specified cylinder strength is 10 ksi (69 MPa) at prestress release and 18 ksi (124 MPa) at the time the member is placed in service, typically 28 days. Minimum flexural cracking and tensile strengths of 1.5 and 2 ksi (10 and 14 MPa), respectively, according to ASTM C1609 testing specifications are required. In addition, strain-hardening and ductility requirements are specified. Tensile properties are shown to be more important for structural optimization than cylinder strength. Both building and bridge products are considered because the paper is focused on capacity rather than demand. Both service limit state and strength limit state are covered. When the contribution of fibers to capacity should be included and when they may be ignored is shown. It is further shown that the traditional equivalent rectangular stress block in compression can still be used to produce satisfactory results in prestressed concrete members. A spreadsheet workbook is offered online as a design tool. It is valid for multilayers of concrete of different strengths, rows of reinforcing bars of different grades, and prestressing strands. It produces moment-curvature diagrams and flexural capacity at ultimate strain. A fully worked-out example of a 250 ft (76.2 m) span decked I-beam of optimized shape is given.


Author(s):  
Theresa Han ◽  
Eunin Cho ◽  
Jinwoo Heo ◽  
Seoung Jae Lee

Abstract In the manufacture of Printed Wiring Boards (PWB), unwelcome structures, such as nodules and whiskers can be formed during copper electroplating with copper sulfate. Copper (Cu) whiskers with lengths of up to a few hundred micrometers can lead to electrical shorts between layers or patterns. In this paper, we document factors that can affect the growth of Cu whiskers; decomposition of additives in the Cu electroplating solution, surface stress, acidic cleaner, and the ingredients of a dry film. Contaminants from outside of the electroplating bath and the ingredients of the dry film were shown as key components in the formation of Cu whiskers.


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