Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)
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9781479940264
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Thermo-mechanical challenges for quantum devices

2014 ◽  
Author(s):  
Alexander W. J. Gielen ◽  
Fidel Valega McKenzie
Keyword(s):  
Quantum Devices

Reliability of carbon nanotube bumps for chip on glass application

2014 ◽  
Author(s):  
Xiaogang Fan ◽  
Xiaolei Li ◽  
Wei Mu ◽  
Di Jiang ◽  
Shirong Huang ◽  
...  
Keyword(s):  
Carbon Nanotube

Novel glass welding technique for hermetic encapsulation

2014 ◽  
Author(s):  
Heidi Lunden ◽  
Tero Kumpulainen ◽  
Antti Matanen ◽  
Jorma Vihinen
Keyword(s):  
Welding Technique

Roll-to-roll paper sensors (ROPAS); Wireless communicating sensors on paper in the logistic chain

2014 ◽  
Author(s):  
Corne Rentrop ◽  
Erik Rubingh ◽  
Ruben Lelieveld ◽  
Henrik Sandberg
Keyword(s):  
Roll To Roll ◽  
Logistic Chain

Impact of recurrent stretching on the performance of electro-textile UHF RFID tags

2014 ◽  
Author(s):  
Toni Bjorninen ◽  
Johanna Virkki ◽  
Lauri Sydanheimo ◽  
Leena Ukkonen
Keyword(s):  
Rfid Tags ◽  
Uhf Rfid

Towards wireless neural electrodes: System-integration for stimulating and recording of nerve signals

2014 ◽  
Author(s):  
Melinda Varga ◽  
Katharina Schulz ◽  
Armin Taschwer ◽  
Klaus-Jurgen Wolter
Keyword(s):  
System Integration ◽  
Neural Electrodes

A cost effective method for TSV backside reveal

2014 ◽  
Author(s):  
L. Wang ◽  
H. Li ◽  
C. Song ◽  
W. Zhang
Keyword(s):  
Cost Effective ◽  
Cost Effective Method
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