Thermomechanical stress analysis of copper/silicon interface in through silicon vias using FEM simulations and experimental analysis
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2019 ◽
Vol 106
(5)
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pp. 785-798
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2011 ◽
Vol 41
(2)
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pp. 322-335
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2012 ◽
Vol 11
(1)
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pp. 8-11
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