Thermal aging effect on copper wire and micro interfacial frictional behavior along Cu FAB and Al pad

2010 ◽  
Author(s):  
Hsiang-Chen Hsu ◽  
Chih-Chiang Fu ◽  
Hong-Shen Chang ◽  
Shen-Li Fu ◽  
Huang-Kuang Kung
Keyword(s):  
Thermal Aging ◽  
Copper Wire ◽  
Aging Effect ◽  
Frictional Behavior

Thermal aging effect of vanadyl acetylacetonate precursor for deposition of VO2 thin films with thermochromic properties

2016 ◽  
Vol 82 ◽  
pp. 11-15 ◽  
Author(s):  
Jung-Hoon Yu ◽  
Sang-Hun Nam ◽  
Donguk Kim ◽  
Minha Kim ◽  
Hyeon Jin Seo ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Aging ◽  
Aging Effect ◽  
Vanadyl Acetylacetonate ◽  
Thermochromic Properties ◽  
Vo2 Thin Films

In-situ investigation of thermal aging effect on oxide formation in Ni-base alloy/low alloy steel dissimilar metal weld interfaces

2014 ◽  
Vol 86 ◽  
pp. 295-303 ◽  
Author(s):  
Jongjin Kim ◽  
Seung Hyun Kim ◽  
Kyung Joon Choi ◽  
Chi Bum Bahn ◽  
Il Soon Hwang ◽  
...  
Keyword(s):  
Thermal Aging ◽  
Base Alloy ◽  
Aging Effect ◽  
Low Alloy Steel ◽  
Oxide Formation ◽  
Dissimilar Metal ◽  
In Situ Investigation ◽  
Dissimilar Metal Weld ◽  
Metal Weld

Thermal Aging Effect on the Ratcheting Behavior of Pressurized Elbow Pipe

2018 ◽  
Vol 140 (2) ◽  
Author(s):  
Caiming Liu ◽  
Dunji Yu ◽  
Waseem Akram ◽  
Xu Chen
Keyword(s):  
Stainless Steel ◽  
Austenitic Stainless Steel ◽  
Aging Time ◽  
Thermal Aging ◽  
Aging Temperature ◽  
Aging Process ◽  
Kinematic Hardening ◽  
Aging Effect ◽  
Hardening Model ◽  
User Subroutine

In this study, the ratcheting behaviors of pressurized Z2CN18.10 austenitic stainless steel elbow pipe influenced by the thermal aging process were experimentally investigated in controlled constant internal pressure and reversed in-plane bending after different thermal aging periods (1000 h and 2000 h) at thermal aging temperature of 500 °C. It is shown that the ratcheting behavior of pressured elbow pipe is highly affected by the thermal aging process. The evaluation of ratcheting behavior of pressured elbow pipe was performed using Chen–Jiao–Kim (CJK) kinematic hardening model as a user subroutine of ANSYS. The relationships of yield stress σs and multiaxial parameter χ with thermal aging time were proposed. Ratcheting shakedown boundary of aged elbow pipe was evaluated by CJK model with thermal aging time.

The Thermal-Aging Effect on the Microstructure Evolution and Shear Strength of the Sn-Rich Au-Sn Soldering between Altic and Si Substrate in Microelectronics

2017 ◽  
Vol 751 ◽  
pp. 3-8 ◽  
Author(s):  
Panaaek Athichalinthorn ◽  
Jidsucha Darayen ◽  
Wachira Puttichaem ◽  
Ratchatee Techapiesancharoenkij ◽  
Boonrat Lohwongwatana
Keyword(s):  
Shear Strength ◽  
Microstructure Evolution ◽  
Thermal Aging ◽  
Bonding Strength ◽  
Thermal Cycle ◽  
Aging Effect ◽  
Under Bump Metallization ◽  
Si Substrate ◽  
Si Substrates ◽  
Soldering Alloys

The Au-Sn soldering alloys are commonly used in microsoldering process for microelectronic industry due to fluxless process and relatively low melting temperature with good eutectic microstructures. This study investigated the microstructures of Au-Sn soldering between AlTiC and Si substrates with Ti/Pt/Au under bump metallization (UBM). The microstructures of the solder samples under three conditions: before bonding, after bonding and after thermal-cycle aging, were investigated. The shear strength values of pre-aging and post-aging soldering were compared. The thermal-cycling temperatures were ranged from -40 to 125 °C for 300 cycles. The intermetallic compounds (IMCs) of the AuSn solders consist of AuSn, AuSn2, and AuSn4. After thermal-cycle aging, the bonding strength was increased due to the improved IMC bonding between solders and UBM; the shear surfaces were rougher due to the growth of AuSn and AuSn2.

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