2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)

Fabrication of freestanding thin Pt/W thermocouple by Joule heat welding

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/esime.2010.5464556 ◽

2010 ◽

Cited By ~ 1

Author(s):

Hironori Tohmyoh ◽

Hironao Takeda ◽

Mohammed N. I. Khan ◽

Masumi Saka

Keyword(s):

Joule Heat

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GaAs-based laser diode bonding-induced stress investigation by means of simulation and Degree of Polarization of photoluminescence measurements

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/esime.2010.5464589 ◽

2010 ◽

Author(s):

Julien LeClecH ◽

Daniel T. Cassidy ◽

Michel Biet ◽

Francois Laruelle ◽

Mauro Bettiati ◽

...

Keyword(s):

Laser Diode ◽

Degree Of Polarization ◽

Induced Stress

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An on-chip experimental assessment Of Casimir force effect in micro-electromechanical systems

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/esime.2010.5464555 ◽

2010 ◽

Cited By ~ 1

Author(s):

Raffaele Ardito ◽

Biagio de Masi ◽

Attilio Frangi ◽

Alberto Corigliano

Keyword(s):

Casimir Force ◽

Experimental Assessment ◽

Electromechanical Systems ◽

Force Effect ◽

On Chip

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Aging effects of Epoxy Moulding Compound on the long-term stability of plastic package

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/esime.2010.5464615 ◽

2010 ◽

Cited By ~ 4

Author(s):

Eric Nguegang ◽

Jochen Franz ◽

Andre Kretschmann ◽

Hermann Sandmaier

Keyword(s):

Aging Effects ◽

Term Stability ◽

Long Term Stability ◽

Plastic Package ◽

Moulding Compound

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Mechanical and thermal simulations of a microactuator for the Stimulation of the Perilymph

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/esime.2010.5464582 ◽

2010 ◽

Author(s):

T. Creutzburg ◽

H.H. Gatzen

Keyword(s):

Thermal Simulations ◽

Stimulation Of

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Light degradation prediction of high-power light-emitting diode lighting modules

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/esime.2010.5464613 ◽

2010 ◽

Author(s):

Yen-Fu Su ◽

Shin-Yueh Yang ◽

Wei-Hao Chi ◽

Kuo-Ning Chiang

Keyword(s):

High Power ◽

Light Emitting Diode ◽

Light Emitting

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Analytical and FEM simulations of the thermal spreading effect in LED modules and IR thermography validation

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/esime.2010.5464567 ◽

2010 ◽

Cited By ~ 10

Author(s):

A. Corfa ◽

A. Gasse ◽

S. Bernabe ◽

H. Ribot

Keyword(s):

Ir Thermography ◽

Spreading Effect ◽

Fem Simulations

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Vibration reliability of SMD Pb-free solder joints

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/esime.2010.5464536 ◽

2010 ◽

Author(s):

Mario Borras ◽

Roumen Ratchev ◽

Olivier Lanier ◽

Michael Guyenot ◽

Daniel Coutellier

Keyword(s):

Solder Joints ◽

Vibration Reliability ◽

Free Solder

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Are current turbulence modeling practices addressing industry's needs for electronics thermal design?

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/esime.2010.5464509 ◽

2010 ◽

Author(s):

Peter Rodgers ◽

Valerie Eveloy

Keyword(s):

Turbulence Modeling ◽

Thermal Design ◽

Modeling Practices

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Flexible Circuits with embedded resistors subjected to extreme thermal loading conditions using the Shadow Moiré and FEM measurements techniques

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/esime.2010.5464575 ◽

2010 ◽

Cited By ~ 2

Author(s):

Luciano Arruda ◽

Luanda Marinho ◽

Edson Silva ◽

Willy Machado

Keyword(s):

Thermal Loading ◽

Loading Conditions ◽

Embedded Resistors

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2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Fabrication of freestanding thin Pt/W thermocouple by Joule heat welding

GaAs-based laser diode bonding-induced stress investigation by means of simulation and Degree of Polarization of photoluminescence measurements

An on-chip experimental assessment Of Casimir force effect in micro-electromechanical systems

Aging effects of Epoxy Moulding Compound on the long-term stability of plastic package

Mechanical and thermal simulations of a microactuator for the Stimulation of the Perilymph

Light degradation prediction of high-power light-emitting diode lighting modules

Analytical and FEM simulations of the thermal spreading effect in LED modules and IR thermography validation

Vibration reliability of SMD Pb-free solder joints

Are current turbulence modeling practices addressing industry's needs for electronics thermal design?

Flexible Circuits with embedded resistors subjected to extreme thermal loading conditions using the Shadow Moiré and FEM measurements techniques

Export Citation Format

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Fabrication of freestanding thin Pt/W thermocouple by Joule heat welding

GaAs-based laser diode bonding-induced stress investigation by means of simulation and Degree of Polarization of photoluminescence measurements

An on-chip experimental assessment Of Casimir force effect in micro-electromechanical systems

Aging effects of Epoxy Moulding Compound on the long-term stability of plastic package

Mechanical and thermal simulations of a microactuator for the Stimulation of the Perilymph

Light degradation prediction of high-power light-emitting diode lighting modules

Analytical and FEM simulations of the thermal spreading effect in LED modules and IR thermography validation

Vibration reliability of SMD Pb-free solder joints

Are current turbulence modeling practices addressing industry's needs for electronics thermal design?

Flexible Circuits with embedded resistors subjected to extreme thermal loading conditions using the Shadow Moiré and FEM measurements techniques

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)
Latest Publications