The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
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Published By Springer London

9780857292353, 9780857292360

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects ◽

10.1007/978-0-85729-236-0_8 ◽

2011 ◽

pp. 179-195 ◽

Cited By ~ 1

Author(s):

P.-E. Tegehall

Keyword(s):

Solder Joints ◽

Electroless Nickel ◽

Electroless Nickel Immersion Gold ◽

Black Pad ◽

Intermetallic Layers

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Tin Whiskers

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects ◽

10.1007/978-0-85729-236-0_6 ◽

2011 ◽

pp. 123-159 ◽

Cited By ~ 2

Author(s):

Antonello Vicenzo

Keyword(s):

Tin Whiskers

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Lead-Free and Other Process Effects on Conductive Anodic Filamentation Resistance of Glass-Reinforced Epoxy Laminates

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects ◽

10.1007/978-0-85729-236-0_11 ◽

2011 ◽

pp. 255-274

Author(s):

C. Zou ◽

A. Brewin ◽

C. Hunt

Keyword(s):

Lead Free ◽

Process Effects

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Electromigration in Solder Interconnects

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects ◽

10.1007/978-0-85729-236-0_7 ◽

2011 ◽

pp. 161-178 ◽

Cited By ~ 1

Author(s):

R. Labie

Keyword(s):

Solder Interconnects

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PCB Delamination

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects ◽

10.1007/978-0-85729-236-0_12 ◽

2011 ◽

pp. 275-282 ◽

Cited By ~ 1

Author(s):

I. Baylakoglu ◽

E. Hedin

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Factors Affecting the Bulk Embrittlement of Pb-Free Solder Joints

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects ◽

10.1007/978-0-85729-236-0_2 ◽

2011 ◽

pp. 19-63

Author(s):

K. Lambrinou

Keyword(s):

Solder Joints ◽

Factors Affecting ◽

Free Solder

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Electrochemical Behaviour of Solder Alloys

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects ◽

10.1007/978-0-85729-236-0_4 ◽

2011 ◽

pp. 81-103

Author(s):

C. Zou ◽

C. Hunt

Keyword(s):

Electrochemical Behaviour ◽

Solder Alloys

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Deformation and Fatigue of Solders

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects ◽

10.1007/978-0-85729-236-0_1 ◽

2011 ◽

pp. 1-18

Author(s):

Günter Grossmann

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Excessive Warpage of Large Packages During Reflow Soldering

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects ◽

10.1007/978-0-85729-236-0_13 ◽

2011 ◽

pp. 283-296 ◽

Cited By ~ 1

Author(s):

Bart Vandevelde

Keyword(s):

Reflow Soldering

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Popcorn Cracking

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects ◽

10.1007/978-0-85729-236-0_14 ◽

2011 ◽

pp. 297-303

Author(s):

Rainer Dudek

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The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder InterconnectsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Springer London

Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold

Tin Whiskers

Lead-Free and Other Process Effects on Conductive Anodic Filamentation Resistance of Glass-Reinforced Epoxy Laminates

Electromigration in Solder Interconnects

PCB Delamination

Factors Affecting the Bulk Embrittlement of Pb-Free Solder Joints

Electrochemical Behaviour of Solder Alloys

Deformation and Fatigue of Solders

Excessive Warpage of Large Packages During Reflow Soldering

Popcorn Cracking

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Latest Publications