Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'

Ericsson's VLSI mini-fab strategy; low volume VLSI fab to ensure short time to market for Ericsson telecom systems and products

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' ◽

10.1109/iemt.1995.526207 ◽

2002 ◽

Author(s):

K.-I. Engde

Keyword(s):

Time To Market ◽

Low Volume ◽

Short Time

Download Full-text

Utilizing production data to increase factory capacity

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' ◽

10.1109/iemt.1995.526176 ◽

2002 ◽

Author(s):

J. Konopka ◽

W. Trybula

Keyword(s):

Production Data

Download Full-text

Electrical performance trade-offs in ball grid array package designs

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' ◽

10.1109/iemt.1995.526196 ◽

2002 ◽

Cited By ~ 1

Author(s):

K.N. Wang ◽

J.M. Adam ◽

P.A. Dziekowicz

Keyword(s):

Ball Grid Array ◽

Electrical Performance ◽

Trade Offs ◽

Ball Grid Array Package

Download Full-text

Correlation between yield and waiting time: a quantitative study

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' ◽

10.1109/iemt.1995.526094 ◽

2002 ◽

Cited By ~ 6

Author(s):

K. Srinivasan ◽

R. Sandell ◽

S. Brown

Keyword(s):

Quantitative Study ◽

Waiting Time

Download Full-text

Reliability of novel die attach adhesive for snap curing

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' ◽

10.1109/iemt.1995.526106 ◽

2002 ◽

Cited By ~ 3

Author(s):

D.P. Galloway ◽

M. Grosse ◽

M.N. Nguyen ◽

A. Burkhart

Keyword(s):

Die Attach

Download Full-text

Void formation in flip-chip solder bumps. I

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' ◽

10.1109/iemt.1995.526084 ◽

2002 ◽

Cited By ~ 4

Author(s):

L. Goenka ◽

A. Achari

Keyword(s):

Flip Chip ◽

Void Formation ◽

Solder Bumps

Download Full-text

Process integration and optimization of GaAs MESFET and MSM based opto-electronics integrated circuit (OEIC) using statistical experimental design techniques

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' ◽

10.1109/iemt.1995.526205 ◽

2002 ◽

Author(s):

J.S. Wang ◽

C.C. Teng ◽

J.R. Middleton ◽

M. Feng

Keyword(s):

Experimental Design ◽

Integrated Circuit ◽

Process Integration ◽

Statistical Experimental Design ◽

Gaas Mesfet ◽

Design Techniques

Download Full-text

Design of future single wafer logic fabs

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' ◽

10.1109/iemt.1995.526127 ◽

2002 ◽

Cited By ~ 3

Author(s):

P. Castrucci

Download Full-text

How TOC & TPM work together to build the quality toolbox of SDWTs

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' ◽

10.1109/iemt.1995.526092 ◽

2002 ◽

Cited By ~ 1

Author(s):

E. Rose ◽

R. Odom ◽

R. Dunbar ◽

J. Hinchman

Download Full-text

Soldering on gold plated substrates-solder joint reliability and integrity of surface components

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' ◽

10.1109/iemt.1995.526189 ◽

2002 ◽

Cited By ~ 1

Author(s):

J.R. Ganasan

Keyword(s):

Solder Joint ◽

Solder Joint Reliability ◽

Joint Reliability

Download Full-text

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Ericsson's VLSI mini-fab strategy; low volume VLSI fab to ensure short time to market for Ericsson telecom systems and products

Utilizing production data to increase factory capacity

Electrical performance trade-offs in ball grid array package designs

Correlation between yield and waiting time: a quantitative study

Reliability of novel die attach adhesive for snap curing

Void formation in flip-chip solder bumps. I

Process integration and optimization of GaAs MESFET and MSM based opto-electronics integrated circuit (OEIC) using statistical experimental design techniques

Design of future single wafer logic fabs

How TOC & TPM work together to build the quality toolbox of SDWTs

Soldering on gold plated substrates-solder joint reliability and integrity of surface components

Export Citation Format

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Ericsson's VLSI mini-fab strategy; low volume VLSI fab to ensure short time to market for Ericsson telecom systems and products

Utilizing production data to increase factory capacity

Electrical performance trade-offs in ball grid array package designs

Correlation between yield and waiting time: a quantitative study

Reliability of novel die attach adhesive for snap curing

Void formation in flip-chip solder bumps. I

Process integration and optimization of GaAs MESFET and MSM based opto-electronics integrated circuit (OEIC) using statistical experimental design techniques

Design of future single wafer logic fabs

How TOC & TPM work together to build the quality toolbox of SDWTs

Soldering on gold plated substrates-solder joint reliability and integrity of surface components

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'
Latest Publications