ball grid array package
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scholarly journals Harmonic Response Analysis for Ball Grid Array Package Using Computer Finite Element Simulation

2021 ◽  
Vol 2033 (1) ◽  
pp. 012012
Author(s):  
Wei Su ◽  
Wenhao Luo ◽  
Xianshan Dong ◽  
Si Chen ◽  
Agam Tomar
Keyword(s):  
Finite Element ◽  
Finite Element Simulation ◽  
Ball Grid Array ◽  
Response Analysis ◽  
Harmonic Response ◽  
Element Simulation ◽  
Ball Grid Array Package ◽  
Harmonic Response Analysis

scholarly journals Transient Analysis Based on Finite Element Method for Ball Grid Array Package

2021 ◽  
Vol 769 (4) ◽  
pp. 042004
Author(s):  
Wenhao Luo ◽  
Wei Su ◽  
Xianshan Dong ◽  
Zhenhua Nie ◽  
Agam Tomar
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Transient Analysis ◽  
Ball Grid Array ◽  
Ball Grid Array Package ◽  
Element Method

scholarly journals Numerical Simulation of Random Vibration Analysis for Ball Grid Array Package

2021 ◽  
Vol 769 (3) ◽  
pp. 032005
Author(s):  
Wenhao Luo ◽  
Wei Su ◽  
Xianshan Dong ◽  
Zhenhua Nie ◽  
Agam Tomar
Keyword(s):  
Numerical Simulation ◽  
Vibration Analysis ◽  
Random Vibration ◽  
Ball Grid Array ◽  
Ball Grid Array Package ◽  
Random Vibration Analysis

scholarly journals Drop test analysis of ball grid array package using finite element method

2021 ◽  
Vol 1109 (1) ◽  
pp. 012023
Author(s):  
J Gonzaga ◽  
A T Ubando ◽  
E Arriola ◽  
R L Moran ◽  
N R E Lim ◽  
...  
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Ball Grid Array ◽  
Drop Test ◽  
Test Analysis ◽  
Ball Grid Array Package ◽  
Element Method

scholarly journals Failure prediction of the solder joints in the ball-grid-array package under thermal loading

2019 ◽  
Vol 1349 ◽  
pp. 012013
Author(s):  
A F M Yamin ◽  
A S Abdullah ◽  
M F A Manap ◽  
H Yusoff
Keyword(s):  
Thermal Loading ◽  
Solder Joints ◽  
Failure Prediction ◽  
Ball Grid Array ◽  
Ball Grid Array Package

Copper Trace Thermomechanical Reliability Analysis of Ball Grid Array Package

2018 ◽  
Author(s):  
Sean Shih ◽  
Michael YC Lee ◽  
Tse-Wei Liao ◽  
D.S. Liu ◽  
Meng-Kai Shih ◽  
...  
Keyword(s):  
Reliability Analysis ◽  
Ball Grid Array ◽  
Ball Grid Array Package ◽  
Thermomechanical Reliability
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