scholarly journals Ambiphilic Al‐Cu Bonding

2021 ◽  
Author(s):  
Michael Stephen Hill ◽  
Han-Ying Liu ◽  
Ryan Schwamm ◽  
Claire McMullin ◽  
Mary Mahon ◽  
...  
Keyword(s):  
Cu Bonding

Pressureless Cu–Cu bonding using hybrid Cu–epoxy paste and its reliability

2021 ◽  
Author(s):  
Byeong-Uk Hwang ◽  
Kwang-Ho Jung ◽  
Kyung Deuk Min ◽  
Choong-Jae Lee ◽  
Seung-Boo Jung
Keyword(s):  
Cu Bonding

Anomalous output performance enhancement of RGO-based triboelectric nanogenerators by Cu-bonding

Nano Energy ◽  
2021 ◽  
Vol 86 ◽  
pp. 106126
Author(s):  
Ruey-Chi Wang ◽  
Yu-Cheng Lin ◽  
Po-Tsang Chen ◽  
Hsiu-Cheng Chen ◽  
Wan-Ting Chiu
Keyword(s):  
Performance Enhancement ◽  
Output Performance ◽  
Triboelectric Nanogenerators ◽  
Cu Bonding

scholarly journals Ambiphilic Al‐Cu Bonding

2021 ◽  
Author(s):  
Michael Stephen Hill ◽  
Han-Ying Liu ◽  
Ryan Schwamm ◽  
Claire McMullin ◽  
Mary Mahon ◽  
...  
Keyword(s):  
Cu Bonding

Hydrogen thermal reductive Cu nanowires in low temperature Cu–Cu bonding

2017 ◽  
Vol 27 (7) ◽  
pp. 075019 ◽  
Author(s):  
Li Du ◽  
Tielin Shi ◽  
Lei Su ◽  
Zirong Tang ◽  
Guanglan Liao
Keyword(s):  
Low Temperature ◽  
Cu Nanowires ◽  
Cu Bonding

High-precision wafer-level Cu-Cu bonding for 3DICs

2014 ◽  
Author(s):  
Masashi Okada ◽  
Isao Sugaya ◽  
Hajime Mitsuishi ◽  
Hidehiro Maeda ◽  
Toshimasa Shimoda ◽  
...  
Keyword(s):  
High Precision ◽  
Wafer Level ◽  
Cu Bonding
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