Degradation analysis on trend gamma process

Author(s):  
Yi‐Fu Wang ◽  
Yufen Huang ◽  
Wei‐Chieh Liao
Author(s):  
Junyu Guo ◽  
Hong-Zhong Huang ◽  
Weiwen Peng ◽  
Jie Zhou

Degradation analysis is a popular and effective method for reliability analysis of long-life and high-reliability products. However, for newly developed products, especially for highly customized products with small sample size, the challenge of sparse degradation observations with product heterogeneity is still an open issue deserving further research. In this article, Bayesian degradation analysis is presented for reliability analysis of products with heterogeneity. The degradation process is modeled by a Gamma process. Random effects are incorporated in the Gamma process model for characterizing the individual heterogeneity. To improve the precision of parameter estimation and degradation analysis, a Bayesian information fusion is presented to leverage degradation information from multiple sources. The proposed model is demonstrated through degradation-based reliability analysis of heavy-duty machine tool’s spindle system, which is characterized as degradation analysis with individual heterogeneity and information fusion.


2015 ◽  
Vol 64 (1) ◽  
pp. 463-472 ◽  
Author(s):  
Man Ho Ling ◽  
Kwok Leung Tsui ◽  
Narayanaswamy Balakrishnan

Author(s):  
Zhao-Yi Fan ◽  
Hua Ju ◽  
Feng-Bin Sun

Some life tests result in few or no failures. In such cases, we can, and should, consider using degradation measurements to assess reliability. In real world, product degradation is a stochastic process. Since such degradation is often seen as a monotonous process, literature widely uses Gamma Process to describe and quantify degradation. However, in these publications, scale parameter is considered constant over time and results under this assumption may have big deviation from the actual measurements under nonlinear condition. The purpose of this paper is to improve Gamma Process method to fit a broader class of degradation models. Firstly, we use MLE to estimate the parameters under the timely constant-scale-parameter assumption and analyze why the model does not fit data well. Then we propose an improved model to improve the method and use Monte Carlo simulation to verify the validity of the improved method.


2008 ◽  
Vol 128 (5) ◽  
pp. 732-737
Author(s):  
Hiroyuki Ichikawa ◽  
Masashi Ito ◽  
Chie Fukuda ◽  
Kotaro Hamada ◽  
Akira Yamaguchi ◽  
...  

2013 ◽  
Vol 56 (4) ◽  
pp. 133-135
Author(s):  
Yuki IKEDA ◽  
Satoru IWAMORI ◽  
Hiroyuki MATSUMOTO ◽  
Kiyoshi YOSHINO ◽  
Itsuo NISHIYAMA ◽  
...  

Author(s):  
Bhanu Sood ◽  
Diganta Das ◽  
Michael H. Azarian ◽  
Michael Pecht

Abstract Negative resistance drift in thick film chip resistors in high temperature and high humidity application conditions was investigated. This paper reports on the investigation of possible causes including formation of current leakage paths on the printed circuit board, delamination between the resistor protective coating and laser trim, and the possibility of silver migration or copper dendrite formation. Analysis was performed on a set of circuit boards exhibiting failures due to this phenomenon. Electrical tests after mechanical and chemical modifications showed that the drift was most likely caused by moisture ingress that created a conductive path across the laser trim.


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