Robust design under cumulative damage due to dynamic failure mechanisms

2021 ◽  
Author(s):  
Avner Engel ◽  
Amit Teller ◽  
Shalom Shachar ◽  
Yoram Reich
1998 ◽  
Vol 554 ◽  
Author(s):  
David M. Owen ◽  
Ares J. Rosakis ◽  
William L. Johnson

AbstractThe understanding of dynamic failure mechanisms in bulk metallic glasses is important for the application of this class of materials to a variety of engineering problems. This is true not only for design environments in which components are subject to high loading rates, but also when components are subjected to quasi-static loading conditions where observations have been made of damage propagation occurring in an unstable, highly dynamic manner. This paper presents preliminary results of a study of the phenomena of dynamic crack initiation and growth as well as the phenomenon of dynamic localization (shear band formation) in a beryllium-bearing bulk metallic glass, Zr41.25Ti13.75Ni10Cu12.75Be22.5. Pre-notched and prefatigued plate specimens were subjected to quasi-static and dynamic three-point bend loading to investigate crack initiation and propagation. Asymmetric impact loading with a gas gun was used to induce dynamic shear band growth. The mechanical fields in the vicinity of the dynamically loaded crack or notch tip were characterized using high-speed optical diagnostic techniques. The results demonstrated a dramatic increase in the crack initiation toughness with loading rate and subsequent crack tip speeds approaching 1000 m s−1. Dynamic crack tip branching was also observed under certain conditions. Shear bands formed readily under asymmetric impact loading. The shear bands traveled at speeds of approximately 1300 m s−1 and were accompanied by intense localized heating measured using high-speed full-field infrared imaging. The maximum temperatures recorded across the shear bands were in excess of 1500 K.


2011 ◽  
Vol 27 (1) ◽  
pp. 47-55 ◽  
Author(s):  
K. S. Wang

ABSTRACTIn this paper different failure mechanisms which yield cumulative damage are investigated through two types of hazard rate functions. They have been studied during the past two decades. Type A was developed early by assuming the hazard rate as a function of reliability. There are two kinds of trend, one follows the negative logistic decay model, the other the negative Gompertz decay. Some modifications are suggested according to the failure tendency and convenience of fittings. Type B is developed recently by assuming the hazard rate as a function of the expected operation time, T, which is defined as the integration of reliability over the time, normalized by the mean-time-between-failure. In both types the proposed hazard rates grow with the time monotonically. Typical examples are taken to examine these models, meanwhile the comparisons with the Weibull-typed distribution are also made. The results show that the most of proposed relations are successful in the expression of cumulative damage phenomenon, especially the Type B is a better choice even compared with the Weibull-typed description in some respects. The advantages of the models are discussed based on the physical meanings involved in the parameters.


2019 ◽  
Vol 173 ◽  
pp. 125-128 ◽  
Author(s):  
Ankur Chauhan ◽  
Xiangyu Sun ◽  
Kaliat T. Ramesh ◽  
Kevin J. Hemker

1991 ◽  
pp. 114-126 ◽  
Author(s):  
S.J. Burns ◽  
S. M. Gracewski ◽  
N. Vakil ◽  
A. R. Basu

Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.


Author(s):  
Robert C. Cieslinski ◽  
H. Craig Silvis ◽  
Daniel J. Murray

An understanding of the mechanical behavior polymers in the ductile-brittle transition region will result in materials with improved properties. A technique has been developed that allows the realtime observation of dynamic plane stress failure mechanisms in the transmission electron microscope. With the addition of a cryo-tensile stage, this technique has been extented to -173°C, allowing the observation of deformation during the ductile-brittle transition.The technique makes use of an annealed copper cartridge in which a thin section of bulk polymer specimen is bonded and plastically deformed in tension in the TEM using a screw-driven tensile stage. In contrast to previous deformation studies on solvent-cast films, this technique can examine the frozen-in morphology of a molded part.The deformation behavior of polypropylene and polypropylene impact modified with EPDM (ethylene-propylene diene modified) and PE (polyethylene) rubbers were investigated as function of temperature and the molecular weight of the impact modifier.


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