An Analytic Framework of Design for Semiconductor Manufacturing

Researchers interested in testing mediation often use designs where participants are measured on a dependent variable Y and a mediator M in both of two different circumstances. The dominant approach to assessing mediation in such a design, proposed by Judd, Kenny, and McClelland (2001), relies on a series of hypothesis tests about components of the mediation model and is not based on an estimate of or formal inference about the indirect effect. In this paper we recast Judd et al.’s approach in the path-analytic framework that is now commonly used in between-participant mediation analysis. By so doing, it is apparent how to estimate the indirect effect of a within-participant manipulation on some outcome through a mediator as the product of paths of influence. This path analytic approach eliminates the need for discrete hypothesis tests about components of the model to support a claim of mediation, as Judd et al’s method requires, because it relies only on an inference about the product of paths— the indirect effect. We generalize methods of inference for the indirect effect widely used in between-participant designs to this within-participant version of mediation analysis, including bootstrap confidence intervals and Monte Carlo confidence intervals. Using this path analytic approach, we extend the method to models with multiple mediators operating in parallel and serially and discuss the comparison of indirect effects in these more complex models. We offer macros and code for SPSS, SAS, and Mplus that conduct these analyses.

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NanoProbing on 7 nm FinFET Devices in an SRAM Array: Challenges and Solutions

ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2019p0329 ◽

2019 ◽

Author(s):

Anqi Qiu ◽

William Lowe ◽

Mridul Arora

Keyword(s):

Manufacturing Process ◽

Semiconductor Manufacturing

Abstract Nanoprobing systems have evolved to meet the challenges from recent innovations in the semiconductor manufacturing process. This is demonstrated through an exhibition of standard SRAM measurements on TSMC 7 nm FinFET technology. SEM based nanoprober is shown to meet or exceed the requirements for measuring 7nm technology and beyond. This paper discusses in detail of the best-known methods for nanoprobing on 7nm technology.

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Fine ceramics (advanced ceramics, advanced technical ceramics). Test method for plasma resistance of ceramic components in semiconductor manufacturing equipment

10.3403/30350531 ◽

2019 ◽

Keyword(s):

Semiconductor Manufacturing ◽

Test Method ◽

Advanced Ceramics ◽

Manufacturing Equipment ◽

Plasma Resistance ◽

Ceramic Components ◽

Technical Ceramics ◽

Fine Ceramics

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A Distributed-Ledger, Edge-Computing Architecture for Automation and Computer Integration in Semiconductor Manufacturing

Global Journal of Computer Science and Technology ◽

10.34257/gjcstgvol20is3pg13 ◽

2020 ◽

pp. 13-29

Author(s):

Da-Yin Liao

Keyword(s):

Semiconductor Manufacturing ◽

Manufacturing Systems ◽

Edge Computing ◽

Legacy Systems ◽

Software Framework ◽

Computer Integration ◽

Computing Architecture ◽

Disruptive Technologies ◽

Distributed Ledger ◽

Operational Structure

Contemporary 300mm semiconductor manufacturing systems have highly automated and digitalized cyber-physical integration. They suffer from the profound problems of integrating large, centralized legacy systems with small islands of automation. With the recent advances in disruptive technologies, semiconductor manufacturing has faced dramatic pressures to reengineer its automation and computer integrated systems. This paper proposes a Distributed-Ledger, Edge-Computing Architecture (DLECA) for automation and computer integration in semiconductor manufacturing. Based on distributed ledger and edge computing technologies, DLECA establishes a decentralized software framework where manufacturing data are stored in distributed ledgers and processed locally by executing smart contracts at the edge nodes. We adopt an important topic of automation and computer integration for semiconductor research &development (R&D) operations as the study vehicle to illustrate the operational structure and functionality, applications, and feasibility of the proposed DLECA software framework.

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