Re-entry Test Vehicle Configuration Selection and Analysis

2016 ◽  
pp. 199-235 ◽  
Author(s):  
Erwin Mooij
Keyword(s):  
Test Vehicle ◽  
Configuration Selection ◽  
Vehicle Configuration

Rocket-powered single-stage vehicle configuration selection and design

1994 ◽  
Vol 31 (5) ◽  
pp. 792-798 ◽  
Author(s):  
Douglas O. Stanley ◽  
Walter C. Engelund ◽  
Roger A. Lepsch ◽  
Mark McMillin ◽  
Kathryn E. Wurster ◽  
...  
Keyword(s):  
Single Stage ◽  
Configuration Selection ◽  
Vehicle Configuration

Preparation of integrated circuits for TEM electromigration in situ studies

1986 ◽  
Vol 44 ◽  
pp. 882-883
Author(s):  
J. V. Maskowitz ◽  
W. E. Rhoden ◽  
D. R. Kitchen ◽  
R. E. Omlor ◽  
P. F. Lloyd
Keyword(s):  
Integrated Circuits ◽  
Crystallographic Orientation ◽  
Silicon Wafers ◽  
Minimum Size ◽  
Test Vehicle ◽  
In Situ Studies ◽  
Boron Doped ◽  
Doped Silicon ◽  
Drill Holes

The fabrication of the aluminum bridge test vehicle for use in the crystallographic studies of electromigration involves several photolithographic processes, some common, while others quite unique. It is most important to start with a clean wafer of known orientation. The wafers used are 7 mil thick boron doped silicon. The diameter of the wafer is 1.5 inches with a resistivity of 10-20 ohm-cm. The crystallographic orientation is (111).Initial attempts were made to both drill and laser holes in the silicon wafers then back fill with photoresist or mounting wax. A diamond tipped dentist burr was used to successfully drill holes in the wafer. This proved unacceptable in that the perimeter of the hole was cracked and chipped. Additionally, the minimum size hole realizable was > 300 μm. The drilled holes could not be arrayed on the wafer to any extent because the wafer would not stand up to the stress of multiple drilling.

OPTIMIZATION OF THE FOREBODY OF A SUPERSONIC FLYING VEHICLE CONFIGURATION WITH A WINDWARD INTAKE

2015 ◽  
Vol 46 (7) ◽  
pp. 631-646
Author(s):  
Sergey Alexandrovich Takovitskii
Keyword(s):  
Vehicle Configuration

Introduction of a Novel Sample Preparation Technique for the Failure Analysis of Silicon Integrated Photonics Modules

2019 ◽  
Author(s):  
Pradip Sairam Pichumani ◽  
Fauzia Khatkhatay
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Silicon Photonics ◽  
Cmos Technology ◽  
Single Step ◽  
Oxide Semiconductor ◽  
Disruptive Technology ◽  
Preparation Technique ◽  
Test Vehicle ◽  
Sample Preparation Technique

Abstract Silicon photonics is a disruptive technology that aims for monolithic integration of photonic devices onto the complementary metal-oxide-semiconductor (CMOS) technology platform to enable low-cost high-volume manufacturing. Since the technology is still in the research and development phase, failure analysis plays an important role in determining the root cause of failures seen in test vehicle silicon photonics modules. The fragile nature of the test vehicle modules warrants the development of new sample preparation methods to facilitate subsequent non-destructive and destructive analysis methods. This work provides an example of a single step sample preparation technique that will reduce the turnaround time while simultaneously increasing the scope of analysis techniques.

An effective procedure for extracting the first few bridge frequencies from a test vehicle

2021 ◽  
Author(s):  
Y. B. Yang ◽  
Hao Xu ◽  
X. Q. Mo ◽  
Z. L. Wang ◽  
Y. T. Wu
Keyword(s):  
Effective Procedure ◽  
Test Vehicle
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