HEVC Double Compression Detection Based on SN-PUPM Feature

2017 ◽  
pp. 3-17 ◽  
Author(s):  
Qianyi Xu ◽  
Tanfeng Sun ◽  
Xinghao Jiang ◽  
Yi Dong
Keyword(s):  
Double Compression

scholarly journals Research on the Static Recrystallization and Precipitation Behaviors of a V-N Microalloyed Steel

2013 ◽  
Vol 2013 ◽  
pp. 1-7 ◽  
Author(s):  
Baochun Zhao ◽  
Tan Zhao ◽  
Guiyan Li ◽  
Qiang Lu
Keyword(s):  
Static Recrystallization ◽  
Microalloyed Steel ◽  
Time Interval ◽  
Main Role ◽  
Recrystallization Process ◽  
Compression Tests ◽  
Double Compression ◽  
Higher Temperature ◽  
Lower Temperature ◽  
Temperature Strain

Double compression tests were performed on a Gleeble-3800 thermomechanical simulator to study the softening behaviors of deformed austenite in a V-N microalloyed steel. The static recrystallization volume fractions were calculated by stress offset method, and the kinetic model of static recrystallization was constructed. The effects of temperature, strain, and time interval on the softening behaviors were analyzed, and the interactions between precipitation and recrystallization were discussed. The results show that the softening behaviors of the deformed austenite at lower temperature or higher temperature are markedly different. At the temperature of 850°C or 800°C, pinning effects of the precipitates play the main role, and the recrystallization process is inhibited, which leads to the formation of plateaus in the softening curves. An increase in strain promotes the precipitation and recrystallization processes while reduces the inhibition effect of precipitation on recrystallization as well.

Device Packaging Techniques for Implementing a Novel Thermal Flux Method for Fluid Degassing and Charging of a Planar Microscale Loop Heat Pipe

2011 ◽  
Author(s):  
Navdeep S. Dhillon ◽  
Jim C. Cheng ◽  
Albert P. Pisano
Keyword(s):  
High Temperature ◽  
Heat Pipe ◽  
Thermal Flux ◽  
Anodic Bonding ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Pressure Gradients ◽  
Flux Method ◽  
Double Compression ◽  
Plastic Package

A novel two-port thermal flux method is implemented for degassing a microscale loop heat pipe (mLHP) and charging it with a working fluid. The mLHP is fabricated on a silicon wafer using standard MEMS micro-fabrication techniques, and capped by a Pyrex wafer, using anodic bonding. For these devices, small volumes and large capillary forces render conventional vacuum pump-based methods quite impractical. Instead, we employ thermally generated pressure gradients to purge non-condensible gases from the device, by vapor convection. Three different, high-temperature-compatible, MEMS device packaging techniques have been studied and implemented, in order to evaluate their effectiveness and reliability. The first approach uses O-rings in a mechanically sealed plastic package. The second approach uses an aluminum double compression fitting assembly for alignment, and soldering for establishing the chip-to-tube interconnects. The third approach uses a high temperature epoxy to hermetically embed the device in a machined plastic base package. Using water as the working fluid, degassing and filling experiments are conducted to verify the effectiveness of the thermal flux method.

scholarly journals Treatment of juvenile hallux valgus interphalangeus with a double compression headless bone screw

2015 ◽  
pp. bcr2015210204 ◽  
Author(s):  
Ferdi Göksel ◽  
Cenk Ermutlu ◽  
Umut Hatay Gölge ◽  
Burak Kaymaz
Keyword(s):  
Hallux Valgus ◽  
Bone Screw ◽  
Double Compression ◽  
Hallux Valgus Interphalangeus
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