Low- and high-frequency NVH CAE – test methods for development of a lightweight sedan design

2019 ◽  
pp. 21-41 ◽  
Author(s):  
Yuksel Gur ◽  
Jian Pan ◽  
David A. Wagner
Keyword(s):  
High Frequency ◽  
Test Methods

Round-Robin of High-Frequency Test Methods by IPC-D24C Task Group

2016 ◽  
Vol 13 (3) ◽  
pp. 77-94
Author(s):  
Glenn Oliver ◽  
Jonathan Weldon ◽  
Chudy Nwachukwu ◽  
John Andresakis ◽  
John Coonrod ◽  
...  
Keyword(s):  
Dielectric Properties ◽  
High Frequency ◽  
High Speed ◽  
Test Methods ◽  
Round Robin ◽  
Standard Test ◽  
Test Method ◽  
Task Group ◽  
Circuit Board ◽  
Industry Standard

Currently, there is no industry standard test method for measuring dielectric properties of circuit board materials at frequencies greater than ~10 GHz. Various material vendors and test laboratories apply different approaches to determine these properties. It is common for these different approaches to yield varying values of key properties such as permittivity and loss tangent. The D-24C Task Group of IPC has developed this round-robin program to assess these various methods from the “bottom up” to determine if standardized methods can be agreed upon to provide the industry with more accurate and valid characteristics of dielectrics used in high-frequency and high-speed applications.

Plating reliability and high frequency testing of DuPont™ GreenTape™ 9K7 LTCC

2013 ◽  
Vol 2013 (1) ◽  
pp. 000678-000682
Author(s):  
Allan Beikmohamadi ◽  
Patricia Graddy ◽  
Deepukumar Nair ◽  
Jim Parisi ◽  
Steve Stewart
Keyword(s):  
Thick Film ◽  
High Frequency ◽  
Electroless Nickel ◽  
Test Methods ◽  
Substantial Improvement ◽  
Standard Test ◽  
Low Dielectric ◽  
Industry Standard ◽  
Joint Reliability ◽  
Surface Finishes

Low Temperature Co-fired Ceramic (LTCC) with low dielectric loss is suitable for use on microwave and millimeter wave circuits. Thick film gold or silver conductors are used as metallization on LTCC substrates. Gold prices are increasing at a rapid rate, so efforts were made to lower the dependency on gold by substituting silver with Ni/Au surface finishes as the top conductor. The external thick film silver conductors were plated using a standard Electroless Nickel Immersion Gold (ENIG) process. The Ni/Au surface finishes provides substantial improvement to fretting corrosion, environmental protection, contact resistance, wire bond strengths, solder ability and solder joint reliability. The reliability testing of DuPont™ GreenTape™ 9K7 LTCC with Ni/Au surface finishes is being conducted. The reliability test methods & conditions were chosen from well-established industry standard test protocols. This paper reports the reliability and high frequency testing results on the ENIG plated GreenTape™ 9K7 LTCC system.

Reliability of LTCC using Electroless Nickel Immersion Gold (ENIG) Plating Technology

2014 ◽  
Vol 2014 (1) ◽  
pp. 000687-000691
Author(s):  
Patricia Graddy ◽  
Allan Beikmohamadi ◽  
Deepukumar Nair ◽  
Brad Thrasher ◽  
James Parisi
Keyword(s):  
High Frequency ◽  
Electroless Nickel ◽  
Ceramic Materials ◽  
Test Methods ◽  
Temperature Cycle ◽  
Adhesion Properties ◽  
Environmental Testing ◽  
Electroless Nickel Immersion Gold ◽  
Wire Bond ◽  
The Impact

In an effort to address the impact of rising gold costs on the fabrication expense for high frequency circuits, and maintain circuit quality and reliability, the DuPont™ GreenTape™ 9K7 low temperature co-fired ceramic materials (LTCC) with top silver conductors have been evaluated using electroless nickel immersion gold (ENIG) plating. Results comparable to the quality of efficiency and reliability of traditional gold conductor systems were achieved at reduced costs. LTCC coupons produced using the ENIG process were tested and compared to standard specifications for coupons with gold printed conductors. The test methods used include wire bond and adhesion pull tests on eight layer coupons, and MIL-STD-883 [1] temperature cycle testing on a layered high frequency test pattern. The reliability of the high frequency characteristics including insertion loss and return loss measurements were evaluated periodically throughout 1090 temperature cycles. Adequate results for most applications were obtained using the ENIG plated system compared to gold printed coupons. In an attempt to better understand the boundaries of the ENIG process on 9K7 LTCC and its use as an alternative for gold conductor systems; future testing will explore the effects of additional environmental testing. The added tests will include thermal shock, and temperature and humidity cycling on 9K7 LTCC test coupons. The testing will be conducted in accordance with MIL-STD-883 as a benchmark, and also evaluate wire bond and adhesion properties. This paper will report the reliability test results on plated GreenTape™ 9K7 LTCC systems after exposure to the stated environmental conditions.

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