EMC Test Verification of Spacecraft Electronic Equipment

2020 ◽  
pp. 393-498
Author(s):  
Hua Zhang ◽  
Yuting Zhang ◽  
Chengbo Huang ◽  
Yanxing Yuan ◽  
Lili Cheng
Keyword(s):  
Electronic Equipment ◽  
Test Verification

Neural Network Expert System in the Application of the EMC Design

2015 ◽  
Vol 742 ◽  
pp. 355-359
Author(s):  
Ji Ling Tang ◽  
Nian Feng Li ◽  
Hong Liang Liu
Keyword(s):  
Neural Network ◽  
Expert System ◽  
Electromagnetic Interference ◽  
Optimization Design ◽  
Electromagnetic Coupling ◽  
Electronic Equipment ◽  
Inference Mechanism ◽  
The Common ◽  
Emc Design ◽  
Test Verification

According to the characteristics of the large equipment, electromagnetic interference, using neural network method is put forward a set of for large electronic equipment electromagnetic coupling and interference, the analysis of the expert system based on the large electronic equipment as analysis object, the common interference on the interference classification and coding, the BP neural network is constructed, using neural network, the inference mechanism of expert system for the optimization design, and test verification.

Research and Validation of ICs' TDDB Physics-of-Failure Model

2013 ◽  
Vol 313-314 ◽  
pp. 281-286
Author(s):  
Ming Xu ◽  
Feng Ming Lu ◽  
Chen Hui Zeng
Keyword(s):  
Integrated Circuits ◽  
Test Data ◽  
Semiconductor Device ◽  
Engineering Application ◽  
Test Sample ◽  
Electronic Equipment ◽  
Advanced Technology ◽  
Failure Model ◽  
Physics Of Failure ◽  
Test Verification

In the new era, the reliability technology based on physics of failure (PoF) is playing an increasingly important role in development of electronic equipment. PoF models of electronic products, as the foundation and core of this advanced technology, are the main point of engineering application. With continual scaling of VLSI in electronic equipment, the electric field across gate oxide becomes higher and higher and affects the reliability of semiconductor device greatly. In this paper, TDDB failure mechanism and Physics-of-Failure model was researched firstly. Then the test sample was designed and processed, and the test verification program for TDDB Physics-of-Failure model was carried out to develop the test verification, collect and process test data. Through analyzing test data, the parameters of TDDB model were determined and modified to ensure the Physics-of-Failure model precision and the model could be used in engineering. Based on modified model, the reliability of integrated circuits can be evaluated at designing stage. And the inherent reliability of integrated circuits in electronic equipment could be improved by design optimization to reduce the risk in the process of using.

scholarly journals Research on Test Verification Index system of New Generation Electronic equipment

2018 ◽  
Vol 452 ◽  
pp. 042182
Author(s):  
Jinpeng Yang ◽  
Guangyao Lian ◽  
Junxian Wang ◽  
Ting Ye ◽  
Lei Wang
Keyword(s):  
Index System ◽  
Electronic Equipment ◽  
Test Verification ◽  
New Generation

Waste electrical and electronic equipment (WEEE) handbook

2012 ◽  
Author(s):  
Vannessa Goodship ◽  
Ab Stevels
Keyword(s):  
Electronic Equipment

An Approach for Practical Use of Common-Mode Noise Reduction Technique for In-Vehicle Electronic Equipment

2010 ◽  
Vol E93-B (7) ◽  
pp. 1788-1796 ◽  
Author(s):  
Takanori UNO ◽  
Kouji ICHIKAWA ◽  
Yuichi MABUCHI ◽  
Atsushi NAKAMURA ◽  
Yuji OKAZAKI ◽  
...  
Keyword(s):  
Noise Reduction ◽  
Reduction Technique ◽  
Electronic Equipment ◽  
Common Mode ◽  
Noise Reduction Technique

Miniature Heat Pipes for Thermal Control of Radio-Electronic Equipment

2007 ◽  
Vol 38 (3) ◽  
pp. 245-258 ◽  
Author(s):  
Leonid L. Vasiliev ◽  
Andrei G. Kulakov ◽  
L. L. Vasiliev, Jr ◽  
Mikhail I. Rabetskii ◽  
A. A. Antukh
Keyword(s):  
Heat Pipes ◽  
Thermal Control ◽  
Electronic Equipment ◽  
Radio Electronic

THERMAL ANALYSIS OF PORTABLE ELECTRONIC EQUIPMENT

1998 ◽  
Author(s):  
Katsumi Hisano ◽  
Hideo Iwasaki ◽  
Masaru Ishizuka
Keyword(s):  
Thermal Analysis ◽  
Electronic Equipment

THERMAL FIELD PREDICTION IN ELECTRONIC EQUIPMENT

1986 ◽  
Author(s):  
J. P. Lejannou ◽  
M. Cadre ◽  
A. Latrobe ◽  
A. Viault
Keyword(s):  
Thermal Field ◽  
Electronic Equipment

OPTIMUM PLANING OF EXPERIMENT IN MANUFACTURING THE ELECTRONIC EQUIPMENT

2011 ◽  
Vol 70 (8) ◽  
pp. 731-734 ◽  
Author(s):  
N. D. Koshevoy ◽  
E. M. Kostenko ◽  
V. A. Gordienko ◽  
V. P. Syroklyn
Keyword(s):  
Electronic Equipment
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