THERMAL ANALYSIS OF PORTABLE ELECTRONIC EQUIPMENT

1998 ◽  
Author(s):  
Katsumi Hisano ◽  
Hideo Iwasaki ◽  
Masaru Ishizuka
Keyword(s):  
Thermal Analysis ◽  
Electronic Equipment

Thermal Design, Analysis and Experimental Verification of Electronic Equipment of a Satellite Borne Microwave Radiometer

2013 ◽  
Vol 655-657 ◽  
pp. 84-87 ◽  
Author(s):  
Bo Chen
Keyword(s):  
Thermal Analysis ◽  
Finite Element ◽  
Microwave Radiometer ◽  
Engineering Application ◽  
Element Model ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Element Analysis ◽  
Experiment Verification ◽  
Experimental Values

Thermal design, finite element analysis and experiment verification of electronic equipment of a satellite borne microwave radiometer are introduced. Some methods were adopted to help heat conduct and a finite element model was built. The analysis results show that the temperature scopes of the main structures are from 45°C to63.9°C in the digital control equipment and 45°C to 68.7°C in the receiver equipment and all of junction temperatures of the components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis. The experimental results show that the computing values are close to experimental values and the largest error is 10.1°C, which is allowed for engineering application.

Considerations about the Role and Efficiency of the Transceiver's Heat Sink during Critical Situations

2014 ◽  
Vol 659 ◽  
pp. 365-370
Author(s):  
Arjana Davidescu ◽  
George G. Savii ◽  
Marius Mateas ◽  
Carmen Sticlaru
Keyword(s):  
Thermal Analysis ◽  
Heat Sink ◽  
Critical Factor ◽  
Electronic Equipment ◽  
Dual Band ◽  
Cad Model ◽  
Finite Element Analyses ◽  
Maximal Power ◽  
3D Cad ◽  
Electrical Part

Thermal analysis of electronic equipment is becoming one of the primary aspects of many researches considering the trend line of reducing the size and increasing the speed. As the power of these systems increases and the space allotted to them decreases, heat flux or density becomes a critical factor in designing electronic equipment. The paper deals with thermal behavior of a particular heat sink designed for a VHF-UHF dual-band transceiver with a maximal power of 50 W. In this case, the electrical part generating this amount of power, is a MOSFET having a junction maximal temperature of 150 °C. A 3D CAD model was developed in proEngineer and finite element analyses were run in ANSYS in order to establish the best functioning conditions of the transceiver.

J0601-2-5 Application of a Thermal Network Method to the Thermal Analysis inside a Thin Electronic Equipment Model

2010 ◽  
Vol 2010.7 (0) ◽  
pp. 259-260
Author(s):  
Kenta YAMAZAKI ◽  
Takashi FUKUE ◽  
Masaru ISHIZUKA ◽  
Tomoyuki HATAKEYAMA ◽  
Shinji NAKAGAWA ◽  
...  
Keyword(s):  
Thermal Analysis ◽  
Electronic Equipment ◽  
Thermal Network ◽  
Network Method ◽  
Thermal Network Method

A New Method for Calculating the Copper Coverage of PCB

2012 ◽  
Vol 462 ◽  
pp. 129-134
Author(s):  
Min Jiang ◽  
Cheng Gao ◽  
Jiao Ying Huang ◽  
Gui Cui Fu ◽  
Ying Cheng
Keyword(s):  
Image Processing ◽  
Thermal Analysis ◽  
Electronic Equipment ◽  
New Method ◽  
Traditional Methods ◽  
Reliability Design ◽  
Board Level

This paper introduces a new method to obtain the copper coverage of PCB. Board-level simulation is very important in the thermal analysis and reliability design of electronic equipment. While in the process of PCB modeling, it is difficult to obtain the coverage percentage of copper in the PCB layer. By this method, the calculation of the coverage is converted to MATLAB image processing problems, is more simple than the traditional methods and the precision is higher, with strong practical.

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