Combined influence of Hall effect, ion slip and temperature boundary condition of third kind on MHD channel flow heat transfer

1977 ◽  
Vol 33 (1) ◽  
pp. 11-22 ◽  
Author(s):  
V. Javeri
Keyword(s):  
Heat Transfer ◽  
Boundary Condition ◽  
Hall Effect ◽  
Channel Flow ◽  
Temperature Boundary ◽  
Ion Slip ◽  
Flow Heat ◽  
Temperature Boundary Condition ◽  
Mhd Channel

A Numerical Study on Taylor Flow Heat Transfer in Square Microchannels Under Constant Wall Temperature Boundary Condition

2012 ◽  
Author(s):  
V. Talimi ◽  
Y. S. Muzychka ◽  
S. Kocabiyik
Keyword(s):  
Heat Transfer ◽  
Boundary Condition ◽  
Heat Flux ◽  
Transfer Process ◽  
Wall Temperature ◽  
Heat Transfer Process ◽  
Constant Wall Temperature ◽  
Temperature Boundary ◽  
Slug Flows ◽  
Temperature Boundary Condition

Heat transfer in Taylor flows or slug flows has been examined exclusively by researchers. Noncircular microchannels have not been widely considered in the literature. There is a large gap in research since noncircular microchannels are common structures in microcooling processes. Square and rectangular microchannels are the most important examples. In the present study the heat transfer process in slug flows in square microchannels has been investigated numerically under constant wall temperature boundary condition. The local heat flux for the moving slugs has been converted to total microchannel heat flux using the integration methods suggested recently by the authors. This leads to microchannel wall average heat flux which is the parameter of interest in heat sink problems. Finally, effects of liquid film around bubbles on heat transfer process have been discussed.

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