Modern high-density oxide ceramics with controlled microstructure. Part II. Substantiation of the choice of modifying additives that affect the degree of sintering of oxide ceramics

Refractories ◽  
1996 ◽  
Vol 37 (4) ◽  
pp. 109-119 ◽  
Author(s):  
E. S. Lukin
Keyword(s):  
High Density ◽  
Oxide Ceramics ◽  
Modifying Additives

Metallization Behavior in Aluminum Nitride Electronic Packages

1990 ◽  
Vol 203 ◽  
Author(s):  
Ellice Y. Luh ◽  
Leonard E. Dolhert ◽  
Jack H. Enloe ◽  
John W. Lau
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Properties ◽  
Aluminum Nitride ◽  
High Density ◽  
High Thermal Conductivity ◽  
Electronic Packages ◽  
Oxide Ceramics ◽  
Chemical Behavior ◽  
Hermetic Seal ◽  
Silicon Based

ABSTRACTCharacteristics such as CTE close to that of silicon, high thermal conductivity, and good dielectric properties make aluminum nitride (AIN) an excellent dielectric for packaging silicon-based high density multichip interconnects. However, there remains many aspects of its behavior that have not been characterized. One such example is the behavior of the various metallizations used within a package. As with A12O3, these metallizations must contribute toward a hermetic seal separating the die from the environment. However, the chemical behavior of the metallization systems used for A12O3 may not be compatible with non-oxide ceramics such as AIN. Consequently, these chemical interactions are investigated in view of the requirements for each application within electronic packages. Hermeticity testing results are also included in the discussion.

The Effect of Sb Content on Spark Plasma Sintered High-Density Antimony-Doped Tin Oxide Ceramics

2011 ◽  
Vol 687 ◽  
pp. 204-208 ◽  
Author(s):  
Qi Zhong Li ◽  
Dong Ming Zhang ◽  
Guo Qiang Luo ◽  
Cheng Zhang Li ◽  
Qiang Shen ◽  
...  
Keyword(s):  
Spark Plasma Sintering ◽  
Tin Oxide ◽  
Sintering Temperature ◽  
Glass Melting ◽  
High Density ◽  
Oxide Ceramics ◽  
Sintering Aids ◽  
Maximum Value ◽  
Plasma Sintering ◽  
Spark Plasma

Spark plasma sintering (SPS) is a newly developed technique that enables poorly sinterable tin oxide powder to be fully densified. Sintering without sintering aids is of great importance when SnO2ceramics are used as electrodes in the glass melting industry and aluminum electrometallurgy. Dense and good-conductive Antimony-doped SnO2 ceramics can be achieved by SPS at a lower sintering temperature and in a shorter time. When the Sb2O3concentration is 1.0 mol%, the densities of the samples reach their maximum value, which is 98.2% of the theoretical value. When the content of Sb2O3was 2.44mol%, SnO2ceramics with densities 97.6% can be obtained at 800°C-1000°C, and the resistivity was about 5.19×10-2Ω.cm at the sintering temperature of 1000°C. Defined amount of Sb3+used in our research are beneficial to low the sintering temperature and promote the densification of SnO2ceramics

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