A particle swarm optimization approach to optimize component placement in printed circuit board assembly

2006 ◽  
Vol 35 (5-6) ◽  
pp. 610-620 ◽  
Author(s):  
Yee-Ming Chen ◽  
Chun-Ta Lin
2017 ◽  
Vol 24 (2) ◽  
pp. 143-155 ◽  
Author(s):  
Alex Alexandridis ◽  
Evangelos Paizis ◽  
Eva Chondrodima ◽  
Marios Stogiannos

Author(s):  
Kehan Zeng ◽  
Zhen Tan ◽  
Mingchui Dong ◽  
Ping Yang

AbstractA novel swarm intelligence approach for combinatorial optimization is proposed, which we call probability increment based swarm optimization (PIBSO). The population evolution mechanism of PIBSO is depicted. Each state in search space has a probability to be chosen. The rule of increasing the probabilities of states is established. Incremental factor is proposed to update probability of a state, and its value is determined by the fitness of the state. It lets the states with better fitness have higher probabilities. Usual roulette wheel selection is employed to select states. Population evolution is impelled by roulette wheel selection and state probability updating. The most distinctive feature of PIBSO is because roulette wheel selection and probability updating produce a trade-off between global and local search; when PIBSO is applied to solve the printed circuit board assembly optimization problem (PCBAOP), it performs superiorly over existing genetic algorithm and adaptive particle swarm optimization on length of tour and CPU running time, respectively. The reason for having such advantages is analyzed in detail. The success of PCBAOP application verifies the effectiveness and efficiency of PIBSO and shows that it is a good method for combinatorial optimization in engineering.


2019 ◽  
Vol 33 (14n15) ◽  
pp. 1940043
Author(s):  
Te-Jen Su ◽  
Yi-Feng Chen ◽  
Kun-Liang Lo

Printed Circuit Board (PCB) is a critical component in the IC packaging process. Manufactured PCBs are typically designed for use by a specific kind of chip and cannot be used for multiple chip types. However, allowing different kinds of chips to be served by a single PCB would greatly improve material preparation and production processes. However, the design and manufacturing of PCB for use in multiple chip types raises issues related to minimizing the use of gold wire. Traditional manual methods rely extensively on experience. This paper applies Particle Swarm Optimization (PSO) methods to identify optimal positioning with experimental results showing a 20% reduction of gold wire in multi-use PCB.


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