High-speed observation of pulse energy and pulse width dependences of damage generation in SiC during ultrashort pulse laser drilling

2020 ◽  
Vol 126 (11) ◽  
Author(s):  
Junya Hattori ◽  
Yusuke Ito ◽  
Hiroshi Jo ◽  
Keisuke Nagato ◽  
Naohiko Sugita
2021 ◽  
pp. 127122
Author(s):  
Hiroshi Jo ◽  
Yusuke Ito ◽  
Junya Hattori ◽  
Keisuke Nagato ◽  
Naohiko Sugita

2019 ◽  
Vol 48 (2) ◽  
pp. 242001
Author(s):  
赵万芹 Zhao Wanqin ◽  
梅雪松 Mei Xuesong ◽  
王文君 Wang Wenjun

2010 ◽  
Vol 18 (19) ◽  
pp. 20395 ◽  
Author(s):  
Sven Döring ◽  
Sören Richter ◽  
Stefan Nolte ◽  
Andreas Tünnermann

2019 ◽  
Vol 48 (1) ◽  
pp. 106008
Author(s):  
赵万芹 Zhao Wanqin ◽  
梅雪松 Mei Xuesong ◽  
王文君 Wang Wenjun

2016 ◽  
Vol 55 (9) ◽  
pp. 096109 ◽  
Author(s):  
Joerg Schille ◽  
Lutz Schneider ◽  
André Streek ◽  
Sascha Kloetzer ◽  
Udo Loeschner

1999 ◽  
Vol 68 (5) ◽  
pp. 563-567 ◽  
Author(s):  
S. Nolte ◽  
C. Momma ◽  
G. Kamlage ◽  
A. Ostendorf ◽  
C. Fallnich ◽  
...  

2016 ◽  
Vol 10 (6) ◽  
pp. 863-873 ◽  
Author(s):  
Rin Shinomoto ◽  
◽  
Yusuke Ito ◽  
Toru Kizaki ◽  
Kentaro Tatsukoshi ◽  
...  

Ultrashort pulse laser processing that facilitates high-speed and fine processing of glass materials has received considerable attention in recent years, despite mechanical processing or etching having been the mainstream methods. However, the physical mechanisms of this technique and the influence of various parameters, such as the processing conditions and physical properties of the processed material, on generated shapes are not yet fully understood. In this work, we comprehensively investigated the influence of various parameters of ultrashort pulse lasers on the processing mechanisms through experiments conducted by changing the wavelength, pulse width, repetition rate, and pulse energy over a wide range. The physical effects of the laser parameters on the reflection of light and heat generation were discussed by analyzing the experimental results, and the influence of the parameters on the generated shapes, processing speed, and saturated depth was clarified. In addition, cracks around the ablated area, which are one of the problems concerning glass processing with ultrashort pulse lasers, were observed, and the influence of the pulse energy on the cracks was evaluated. It is expected that this research will allow for a thorough understanding of the laser parameters that are suitable for glass processing and widen the range of laser processing applications.


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