Abrasive-assisted Nickel Electroforming Process with Moving Cathode

Spherical abrasives were employed to polish the growing deposited layer during nickel electroforming process. On a translational flat cathode, nickel deposits with distinct polishing mark were obtained. It was found that the abrasive polishing can help to improve the microstructure and increase the mechanical properties of the nickel deposits. Compared with the deposits prepared with traditional method, the microstructure became more homogeneous and the microhardness increased nearly two times. The increase of current density led to coarse structure and lower microhardness.

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Replication of rose petal surfaces using a nickel electroforming process and UV nanoimprint lithography

Applied Surface Science ◽

10.1016/j.apsusc.2014.10.063 ◽

2014 ◽

Vol 322 ◽

pp. 57-63 ◽

Cited By ~ 11

Author(s):

Sang-woo Ryu ◽

Soyoung Choo ◽

Hak-Jong Choi ◽

Chae-Hyun Kim ◽

Heon Lee

Keyword(s):

Nanoimprint Lithography ◽

Electroforming Process ◽

Nickel Electroforming ◽

Rose Petal

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Surface replication with one-nanometer.level smoothness by a nickel electroforming process

International Journal of Electrical Machining ◽

10.2526/ijem.16.21 ◽

2011 ◽

Vol 16 (0) ◽

pp. 21-25 ◽

Cited By ~ 3

Author(s):

Hidekazu Mimura ◽

Satoshi Matsuyama ◽

Yasuhisa Sano ◽

Kazuto Yamauchi

Keyword(s):

Electroforming Process ◽

Nickel Electroforming

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Numerical simulation of nickel electroforming process influenced by flow field

10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems ◽

10.1109/nems.2015.7147478 ◽

2015 ◽

Cited By ~ 1

Author(s):

Hao Sun ◽

Xiang Wang

Keyword(s):

Numerical Simulation ◽

Flow Field ◽

Electroforming Process ◽

Nickel Electroforming

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Effect of the Thickness Uniformity in Micro-Electroforming Process by Dividing Conductive Zone on Cathode

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.60-61.202 ◽

2009 ◽

Vol 60-61 ◽

pp. 202-206

Author(s):

Li Qun Du ◽

Li Chuan Yu ◽

Lei Song ◽

Chong Liu

Keyword(s):

Theoretical Analysis ◽

Current Density ◽

Thickness Ratio ◽

Experimental Results ◽

Thickness Uniformity ◽

Conductive Zone ◽

Electroforming Process ◽

Nickel Electroforming

In this paper, an effective method is presented to improve thickness uniformity in nickel electroforming process. In most electroforming processes, thickness ratio of edge to center is 2.5~4 and the shape of the electroforming zone is naturally a concave. Dividing conductive zone of electroforming structure to redistribute current density was applied to improve electroforming uniformity. Theoretical analysis and experimental results verify that a proper dividing method can improve the electroforming uniformity effectively. In the experiment, the thickness ratio of edge to center decreases from 2.91 to 1.88.

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