Novel insights in growth of intermetallic compounds between Sn–3.0Ag–0.5Cu solder and flexible PCB substrates under strain

2019 ◽  
Vol 30 (10) ◽  
pp. 9410-9420 ◽  
Author(s):  
Xudong Zhang ◽  
Xiaowu Hu ◽  
Xiongxin Jiang ◽  
Qinglin Li ◽  
Liuru Zhou
1987 ◽  
Vol 48 (C3) ◽  
pp. C3-497-C3-504 ◽  
Author(s):  
B. DUBOST ◽  
M. AUDIER ◽  
P. JEANMART ◽  
J.-M. LANG ◽  
P. SAINFORT

1988 ◽  
Vol 49 (C8) ◽  
pp. C8-375-C8-376
Author(s):  
C. D. Wentworth ◽  
A. f. Deutz ◽  
H. B. Brom

1988 ◽  
Vol 49 (C8) ◽  
pp. C8-393-C8-394 ◽  
Author(s):  
S. Miura ◽  
T. Kaneko ◽  
S. Abe ◽  
G. Kido ◽  
H. Yoshida ◽  
...  

2018 ◽  
Author(s):  
Younghwan Cha ◽  
Jung-In Lee ◽  
Panpan Dong ◽  
Xiahui Zhang ◽  
Min-Kyu Song

A novel strategy for the oxidation of Mg-based intermetallic compounds using CO<sub>2</sub> as an oxidizing agent was realized via simple thermal treatment, called ‘CO2-thermic Oxidation Process (CO-OP)’. Furthermore, as a value-added application, electrochemical properties of one of the reaction products (carbon-coated macroporous silicon) was evaluated. Considering the facile tunability of the chemical/physical properties of Mg-based intermetallics, we believe that this route can provide a simple and versatile platform for functional energy materials synthesis as well as CO<sub>2</sub> chemical utilization in an environment-friendly and sustainable way.


1990 ◽  
Author(s):  
Young K. Kim ◽  
David K. Shuh ◽  
R. S. Williams ◽  
Larry P. Sadwick ◽  
Kang L. Wang

1991 ◽  
Author(s):  
David E. Luzzi ◽  
David P. Pope ◽  
Vaclay Vitek

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