Reactive diffusion in W–Mo–Si thin films

2010 ◽  
Vol 103 (1) ◽  
pp. 111-116 ◽  
Author(s):  
A. Derafa ◽  
M.-C. Record ◽  
D. Mangelinck ◽  
R. Halimi ◽  
A. Bouabellou
2019 ◽  
Vol 488 ◽  
pp. 303-315
Author(s):  
E. Assaf ◽  
A. Portavoce ◽  
L. Patout ◽  
M. Bertoglio ◽  
R. Clérac ◽  
...  

Author(s):  
PATRICK GAS ◽  
CLAIRE BERGMAN ◽  
GERARD CLUGNET ◽  
ELISABETH EMERIC ◽  
FABIEN PASZKO ◽  
...  

2019 ◽  
Vol 21 ◽  
pp. 1-28
Author(s):  
Dominique Mangelinck

Silicide formation by reactive diffusion is of interest in numerous applications especially for contact formation and interconnections in microelectronics. Several reviews have been published on this topic and the aim of this chapter is to provide an update of these reviews by focusing on new experiment results. This chapter presents thus some progress in the understanding of the main mechanisms (diffusion/reaction, nucleation, lateral growth…) for thin and very thin films (i.e. comprised between 4 and 50 nm). Recent experimental results on the mechanisms of formation of silicide are presented and compared to models and/or simulation in order to extract physical parameters that are relevant to reactive diffusion. These mechanisms include nucleation, lateral growth, diffusion/interface controlled growth, and the role of a diffusion barrier. The combination of several techniques including in situ techniques (XRD, XRR, XPS, DSC) and high resolution techniques (APT and TEM) is shown to be essential in order to gain understanding in the solid state reaction in thin films and to better control these reaction for making contacts in microelectronics devices or for other application.


2003 ◽  
Vol 252 (1-3) ◽  
pp. 382-390 ◽  
Author(s):  
V. Pankov ◽  
Å. Bartholdson ◽  
O. Stukalov ◽  
S. Smolenchuk ◽  
O. Babushkin ◽  
...  

1991 ◽  
Vol 53 ◽  
pp. 74-81 ◽  
Author(s):  
J. Philibert

2014 ◽  
Vol 290 ◽  
pp. 340-345 ◽  
Author(s):  
Siqin Meng ◽  
Zhenxing Yue ◽  
Xiaozhi Zhang ◽  
Longtu Li

1995 ◽  
Vol 402 ◽  
Author(s):  
Patrick Gas ◽  
Francois D'Heurle

AbstractDiffusion processes in silicide thin films play a key role both during their formation by reactive diffusion or during their use. However our unique source of information was provided by indirect analysis: growth of thin films and dopant redistribution which are quite difficult to analyse in terms of diffusion mechanisms. Recent tracer experiments conducted in bulk silicides are presented. They allow a determination of both volume (v) and grain boundary (gb) diffusion coefficients. Contrary to what is observed in certain intermetallic compounds no fast volume diffusion mechanism was found. The main difference with the behaviour of pure metals is a slightly higher value of the ratio Qgb/Qv which makes gb diffusion an efficient process in a wider temperature range.A quantitative analysis of diffusion processes during silicide formation is then possible. As an example we propose a comparison between the kinetics of growth of thin films and bulk diffusion couples in the Co/Si and Ti/Si systems. Providing that attention is paid to: i) the laws of growth which are slightly different for a phase growing simultaneously with others (bulk) and one phase growing alone (thin films), and ii) the grain size of the growing phase which is strongly dependant on temperature and thicknesses excellent agreement is obtained between the two sets of measurements. Moreover the growth rates may be calculated quite accurately from the values of the volume and gb tracer diffusion coefficients. This stresses and quantifies the role of interfacial diffusion in thin films behaviour.


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