scholarly journals Polymerization study and rheological behavior of a RTM6 epoxy resin system during preprocessing step

2014 ◽  
Vol 119 (1) ◽  
pp. 329-336 ◽  
Author(s):  
Nicolas Causse ◽  
Stephanie Benchimol ◽  
Lilian Martineau ◽  
Delphine Carponcin ◽  
Antoine Lonjon ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
Rheological Behavior ◽  
Resin System ◽  
Epoxy Resin System

Investigation of the Curing Kinetics and Rheological Behavior of Multifunctional Epoxy Resin System

2011 ◽  
Vol 19 (4-5) ◽  
pp. 345-350
Author(s):  
Zhou Zhengwei ◽  
Bai Ruicheng ◽  
Ren Musu ◽  
Sun Jinliang ◽  
Zhou Ze ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
Rheological Behavior ◽  
Curing Kinetics ◽  
Resin System ◽  
Epoxy Resin System ◽  
Multifunctional Epoxy Resin

scholarly journals Rheological Behavior of Isothermal Cured Epoxy/1,4-Diaminobenzene Systems

2018 ◽  
Vol 11 (1) ◽  
Author(s):  
Salah N. Farhan ◽  
Muataz H. Ismael ◽  
Ayad Dari Jaafar
Keyword(s):  
Epoxy Resin ◽  
Rheological Behavior ◽  
Reaction Rates ◽  
Curing Temperature ◽  
Curing Agent ◽  
Resin System ◽  
Gel Time ◽  
Epoxy Resin System

A novel curing agent (1,4-diaminobenzene) was used to enhance behavior of the epoxy resin system. The effect of the curing agent content (12 to 21 wt%) subjected to the isothermal curing temperatures at 80 °C to 110 °C were performed. Results indicate that the gel time was effected slightly on the viscosity when the curing temperature was higher than 90 °C and curing material consist over from 18wt %. These results explain that reaction rates caused by higher curing temperature.

Characterization of carbon nanotube 3D-structures infused with low viscosity epoxy resin system

2010 ◽  
Vol 92 (9) ◽  
pp. 2252-2257 ◽  
Author(s):  
Celeste M.C. Pereira ◽  
Paulo Nóvoa ◽  
Marta Martins ◽  
Stefan Forero ◽  
Felicitas Hepp ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Epoxy Resin ◽  
Resin System ◽  
3D Structures ◽  
Low Viscosity ◽  
Epoxy Resin System

Cure Kinetics of Epoxy Resin System Toughened by Polyhexamethylene Carbonate Diol

1997 ◽  
Vol 13 (09) ◽  
pp. 848-852
Author(s):  
Chen Tong-Hui ◽  
◽  
Bai Yao-Wen ◽  
Sun Ren-Hui
Keyword(s):  
Epoxy Resin ◽  
Cure Kinetics ◽  
Resin System ◽  
Epoxy Resin System ◽  
Kinetics Of
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