scholarly journals Rheological Behavior of Isothermal Cured Epoxy/1,4-Diaminobenzene Systems

2018 ◽  
Vol 11 (1) ◽  
Author(s):  
Salah N. Farhan ◽  
Muataz H. Ismael ◽  
Ayad Dari Jaafar
Keyword(s):  
Epoxy Resin ◽  
Rheological Behavior ◽  
Reaction Rates ◽  
Curing Temperature ◽  
Curing Agent ◽  
Resin System ◽  
Gel Time ◽  
Epoxy Resin System

A novel curing agent (1,4-diaminobenzene) was used to enhance behavior of the epoxy resin system. The effect of the curing agent content (12 to 21 wt%) subjected to the isothermal curing temperatures at 80 °C to 110 °C were performed. Results indicate that the gel time was effected slightly on the viscosity when the curing temperature was higher than 90 °C and curing material consist over from 18wt %. These results explain that reaction rates caused by higher curing temperature.

Study on Processing Properties of Epoxy Resin System in VARI

2012 ◽  
Vol 463-464 ◽  
pp. 704-707
Author(s):  
Chen Hui Zhao ◽  
Guang Cheng Zhang ◽  
Wei Min Sun ◽  
Ai Hua Shi
Keyword(s):  
Epoxy Resin ◽  
Low Cost ◽  
Curing Temperature ◽  
Resin System ◽  
Gel Time ◽  
Advanced Composite ◽  
Advanced Composite Materials ◽  
Epoxy Resin System ◽  
Processing Properties ◽  
Cast Plate

As a low cost moulding technology, VARI is widely used to produce advanced composite materials. At the same time, the particularity of VARI process make it have particular requirements on resin system. Epoxy resin system attracts extensive attention because of its good process performance. Curing reaction and rheological behavior of epoxy resin system were studied by DSC and viscosity experiments. The results showed that resin viscosity decreased from 2600 mPa•S at 15°C to 600mPa•S at 40°C . Viscosity of resin system rose about 0.5Pa•s within the first 2h. Gel time shortened dramatically when the temperature exceed 60°C. the curing temperature is 60°C be based on DSC curve and gel time-temperature curve. Resin cast plate of epoxy resin system has good mechanical properties of compression strength.

Study on the Preparation of 2-Phenyl Imidazole Microcapsule and its Effect on Curing Epoxy Resin

2013 ◽  
Vol 690-693 ◽  
pp. 1649-1652
Author(s):  
Ai Jie Ma ◽  
Qiu Yu Zhang ◽  
You Qiang Shi
Keyword(s):  
Epoxy Resin ◽  
Raw Materials ◽  
Curing Kinetics ◽  
Curing Temperature ◽  
Curing Agent ◽  
Thermal Analyzer ◽  
Epoxy Resin System ◽  
Curing Kinetic ◽  
Resin Curing ◽  
Micro Morphology

In this paper, 2-phenyl imidazole (2-PZ) microcapsule-type curing agent of epoxy resin were prepared through solvent volatilization with 2-PZ and polymethyl acrylic glycidyl ester (PGMA) as the raw materials. The micro-morphology, shape and structure of the microcapsules were studied by scanning electronic microscope (SEM) and fourier transform infrared spectrum (FT-IR). The curing kinetics of microcapsule curing agent/epoxy resin E-44 curing system were studied using TGA/DSC simultaneous thermal analyzer. Results showed that the preparation method is simple and effective and the prepared 2-PZ microcapsules have smooth surfaces and monodisperse size. And the curing kinetic study of epoxy resin system suggested epoxy resin curing temperature was rising with the increase of heating rate.

The Study on Curing Kinetics of Lignin Based Epoxy Resin System Using Non-Isothermal DSC Method

2013 ◽  
Vol 788 ◽  
pp. 223-227 ◽  
Author(s):  
Ming Qiang Chen ◽  
Shao Min Liu ◽  
Feng Li ◽  
Zhong Lian Yang ◽  
Ye Zhang
Keyword(s):  
Epoxy Resin ◽  
Kinetic Parameters ◽  
Raw Materials ◽  
Curing Kinetics ◽  
Reaction Model ◽  
Curing Temperature ◽  
Resin System ◽  
Curing Reaction ◽  
Epoxy Resin System ◽  
Dsc Method

The synthesis of Lignin Base Epoxy Resin was based on industrial alkali lignin, and lignin-based epoxy resin curing characteristics were analyzed using the thermal weight loss technology under the oxygen atmosphere conditions. In light of the infra-red analysis of raw materials, the curing reaction kinetic parameters of lignin-based epoxy resin system were calculated using the Kissinger-Crane and Flynn-Wall-Ozawa method, and the curing reaction kinetics model of lignin-based epoxy resin system was established. The results showed that the kinetic parameters obtained using two methods were approximate, which validated that the curing reaction was consistent with the principle of the first-order reaction model. Initial curing temperature Ti0=454.88 K, curing temperature Tp0=507.55 K, and terminal temperature Tf0=598.77 K of lignin-based epoxy resin system were obtained when the extrapolation method was applied.

Investigation of the Curing Kinetics and Rheological Behavior of Multifunctional Epoxy Resin System

2011 ◽  
Vol 19 (4-5) ◽  
pp. 345-350
Author(s):  
Zhou Zhengwei ◽  
Bai Ruicheng ◽  
Ren Musu ◽  
Sun Jinliang ◽  
Zhou Ze ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
Rheological Behavior ◽  
Curing Kinetics ◽  
Resin System ◽  
Epoxy Resin System ◽  
Multifunctional Epoxy Resin

Study on curing kinetics of a diglycidyl ether of bisphenol A epoxy resin/microencapsulated curing agent system

2012 ◽  
Vol 24 (8) ◽  
pp. 730-737 ◽  
Author(s):  
Wang Fang ◽  
Xiao Jun ◽  
Wang Jing-wen ◽  
Li Shu-qin
Keyword(s):  
Particle Size ◽  
Bisphenol A ◽  
Epoxy Resin ◽  
Diglycidyl Ether ◽  
Wall Material ◽  
Curing Agent ◽  
Resin System ◽  
Scanning Calorimetry ◽  
Cure Reaction ◽  
Epoxy Resin System

A modified imidazole curing agent, EMI-g-BGE, was encapsulated for one-package of diglycidyl ether of bisphenol A (DGEBA) epoxy resin system. Polyetherimide (PEI) was used as the wall material, and the emulsion solvent evaporation method was used to form the microcapsules. The morphology and particle size distribution of microcapsules were evaluated by scanning electron microscopy (SEM), mastersizer analyzer. Microcapsules exhibited spherical shapes and the mean particle size was about 745 nm. The curing kinetic of DGEBA/microcapsules curing agent was studied by nonisothermal differential scanning calorimetry (DSC) technique at different heating rates. Dynamic DSC scans indicated the microcapsule was an effective curing agent of epoxy resin. The apparent activation energy Ea was 88.03 kJ/mol calculated through Kissinger method, more than DGEBA/EMI-g-BGE system. This microcapsule of EMI-g-BGE exhibited a long shelf life, and the curing did not occur in this epoxy-microcapsule resin system for more than 3months at room temperature. The kinetic parameters were determined by Málek method and a two-parameter ( m, n) autocatalytic model (Šesták–Berggren equation) was found to be the most adequate selected kinetic model, which showed the encapsulation of the curing agent EMI-g-BGE did not change the cure reaction mechanism of the epoxy resin system. From the experimental data, the nonisothermal DSC curves show the results being in accordant with those theoretically calculated.

scholarly journals Polymerization study and rheological behavior of a RTM6 epoxy resin system during preprocessing step

2014 ◽  
Vol 119 (1) ◽  
pp. 329-336 ◽  
Author(s):  
Nicolas Causse ◽  
Stephanie Benchimol ◽  
Lilian Martineau ◽  
Delphine Carponcin ◽  
Antoine Lonjon ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
Rheological Behavior ◽  
Resin System ◽  
Epoxy Resin System

Synthesis and properties of a phosphate ester as curing agent in an epoxy resin system

2014 ◽  
Vol 23 (8) ◽  
pp. 591-598 ◽  
Author(s):  
Chuanmei Jiao ◽  
Juan Dong ◽  
Chongjie Zhang ◽  
Jinlong Zhuo ◽  
Xilei Chen
Keyword(s):  
Epoxy Resin ◽  
Phosphate Ester ◽  
Curing Agent ◽  
Resin System ◽  
Epoxy Resin System

Study on Curing Process of Resin Nanocomposites

2012 ◽  
Vol 501 ◽  
pp. 349-354 ◽  
Author(s):  
Chuan Sheng Wang ◽  
Rui Qin Wang ◽  
Yuan Wang ◽  
Yong Xiang Fu
Keyword(s):  
Activation Energy ◽  
Composite Materials ◽  
Curing Temperature ◽  
Curing Agent ◽  
Curing Process ◽  
Resin System ◽  
Crucial Importance ◽  
Reaction Series ◽  
Epoxy Resin System ◽  
Gel Temperature

In order to get an optimum performance of composite materials, it is of crucial importance to select the best curing process, on condition that resin and curing agent system is determined. In this paper, we studied the curing non-isothermal dynamics of the nmSi02 / epoxy resin system, and calculated the activation energy and reaction series, according to Kissinger, Ozawa and Crane method. We found out the peak temperature, the theory gel temperature and the theory curing temperature with extrapolation as heating rate β= 0. Finally we determined the best curing process range of the system.

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