Formation mechanism of multi-functional black silicon based on optimized deep reactive ion etching technique with SF6/C4F8
2015 ◽
Vol 58
(2)
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pp. 381-389
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2005 ◽
Vol 36
(7)
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pp. 673-677
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Keyword(s):
2003 ◽
Vol 04
(03)
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pp. 581-584
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Keyword(s):
Keyword(s):
Keyword(s):
Keyword(s):
Keyword(s):
Three-dimensional etching of silicon substrates using a modified deep reactive ion etching technique
2011 ◽
Vol 21
(7)
◽
pp. 074005
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Keyword(s):
2011 ◽
Vol 21
(10)
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pp. 105001