Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition

2009 ◽  
Vol 38 (11) ◽  
pp. 2353-2361 ◽  
Author(s):  
Meng Liu ◽  
Ai-Ping Xian
Keyword(s):  
Rare Earth ◽  
Whisker Growth ◽  
Lead Free ◽  
Lead Free Solder ◽  
Tin Whisker ◽  
Nd Addition ◽  
Free Solder

Influence of laminate type on tin whisker growth in tin-rich lead-free solder alloys

2012 ◽  
Vol 177 (15) ◽  
pp. 1286-1291 ◽  
Author(s):  
Agata Skwarek ◽  
Mariusz Pluska ◽  
Andrzej Czerwinski ◽  
Krzysztof Witek
Keyword(s):  
Whisker Growth ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Tin Whisker ◽  
Free Solder

Properties of lead-free solder SnAgCu containing minute amounts of rare earth

2003 ◽  
Vol 32 (4) ◽  
pp. 235-243 ◽  
Author(s):  
Zhigang Chen ◽  
Yaowu Shi ◽  
Zhidong Xia ◽  
Yanfu Yan
Keyword(s):  
Rare Earth ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Investigation on properties of Sn–8Zn–3Bi lead-free solder by Nd addition

2009 ◽  
Vol 480 (2) ◽  
pp. 903-907 ◽  
Author(s):  
Jian Zhou ◽  
Dan Huang ◽  
Yi-Li Fang ◽  
Feng Xue
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Nd Addition ◽  
Free Solder

Lead-Free Solder/Gold Metallization Interdiffusion in Electronic Interconnects – Challenges and their Control

2008 ◽  
Author(s):  
Nausha Asrar
Keyword(s):  
Solder Joint ◽  
Coefficient Of Thermal Expansion ◽  
Void Formation ◽  
Lead Free ◽  
Gold Content ◽  
Lead Free Solder ◽  
Whisker Formation ◽  
Tin Whisker ◽  
Free Solder ◽  
Gold Metallization

Abstract While considerable amount of researches and investigations have been made on lead-free solder joint reliability, limited number of literatures are available on the effect of gold content on lead-free solder joint performance. The challenges of lead-free solder/gold metallization interdiffusion during high temperature application/test are: gold embrittlement, intermetallics growth, void formation, and tin-whisker formation. Tin whiskers causing system failures in earth and space-based applications have been reported. This paper illustrates a few case histories of such challenges. The results confirmed that the synergistic effects of void formation, intermetallic compounds formation due to the thick gold plating, and coefficient of thermal expansion mismatch between organic and ceramic substrates resulted in brittle fracture of the solder joint. The tin whisker formation was attributed to the compressive stress in the tin solder material, which was caused by diffusion of the end-cap metallization, formation of intermetallics, and thermal cycling of the soldered components.

scholarly journals Preliminary study on the effect of Ni addition on tin (Sn) whisker growth from lead-free solder coating

2020 ◽  
Vol 957 ◽  
pp. 012062
Author(s):  
Aimi Noorliyana Hashim ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Muhammad Mahyiddin Ramli ◽  
Khor Chu Yee ◽  
Noor Zaimah Mohd Mokhtar
Keyword(s):  
Whisker Growth ◽  
Lead Free ◽  
Lead Free Solder ◽  
Sn Whisker ◽  
Ni Addition ◽  
Preliminary Study ◽  
Free Solder
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