scholarly journals Preliminary study on the effect of Ni addition on tin (Sn) whisker growth from lead-free solder coating

2020 ◽  
Vol 957 ◽  
pp. 012062
Author(s):  
Aimi Noorliyana Hashim ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Muhammad Mahyiddin Ramli ◽  
Khor Chu Yee ◽  
Noor Zaimah Mohd Mokhtar
Keyword(s):  
Whisker Growth ◽  
Lead Free ◽  
Lead Free Solder ◽  
Sn Whisker ◽  
Ni Addition ◽  
Preliminary Study ◽  
Free Solder

Sn whisker growth in Sn–9Zn–0.5Ga–0.7Pr lead-free solder

2011 ◽  
Vol 509 (5) ◽  
pp. L52-L55 ◽  
Author(s):  
Huan Ye ◽  
Songbai Xue ◽  
Liang Zhang ◽  
Zhengxiang Xiao ◽  
Yuhua Hu ◽  
...  
Keyword(s):  
Whisker Growth ◽  
Lead Free ◽  
Lead Free Solder ◽  
Sn Whisker ◽  
Free Solder

scholarly journals Morphology Analysis of Spontaneous Tin (Sn) Whisker Growth on Lead-Free Solder

2019 ◽  
Vol 551 ◽  
pp. 012095 ◽  
Author(s):  
Aimi Noorliyana Hashim ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Noor Zaimah Mohd Mokhtar
Keyword(s):  
Whisker Growth ◽  
Lead Free ◽  
Lead Free Solder ◽  
Sn Whisker ◽  
Morphology Analysis ◽  
Free Solder

Morphology and Intermetallic Study of (Sn-8Zn-3Bi)-1Ni Solder under Liquid State Aging

2015 ◽  
Vol 1087 ◽  
pp. 162-166
Author(s):  
Nor Aishah Jasli ◽  
Hamidi Abd Hamid ◽  
Ramani Mayappan
Keyword(s):  
Liquid State ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Reflow Time ◽  
Intermetallic Formation ◽  
X Ray ◽  
Ni Addition ◽  
Free Solder ◽  
Scanning Electron

This study investigated the effect of Ni addition on intermetallic formation in the Sn-8Zn-3Bi solder under liquid state aging. The intermetallic compounds were formed by reacting the solder alloy with copper substrate. Different reflow time was used at temperature 220°C. Morphology of the phases formed was observed using scanning electron microscope (SEM) and in order to determine elemental compositions of the phases, energy dispersive x-ray (EDX) was used. The formation of the reaction layer led by Cu5Zn8 intermetallic and then followed by Cu6Sn5 and Cu3Sn when reflow time increases. Keywords: lead free solder, intermetallic, Cu5Zn8, Cu6Sn5, liquid state aging.

The Preliminary Study of the Addition Zinc in Tin-Copper Lead Free Solder

2020 ◽  
Vol 1010 ◽  
pp. 104-108
Author(s):  
Wei Yee Wong ◽  
Rabiatul Adawiyah Shamsudin ◽  
Muhammad Firdaus Mohd Nazeri ◽  
Mohamad Najmi Masri
Keyword(s):  
Xrd Analysis ◽  
Phase Changes ◽  
Lead Free ◽  
Lead Free Solder ◽  
X Ray Diffraction ◽  
High Melting Point ◽  
Alternative Material ◽  
Preliminary Study ◽  
Free Solder ◽  
Oval Shape

Sn-0.7Cu lead free solder has become an alternative material to replace Sn-Pb solder. However, it has the weakness of high melting point and poor corrosion behavior. Through the study, Sn-0.7-xZn microstructure and phase changes were studied through scanning electron microscope (SEM) and X-ray diffraction (XRD). SEM result shows microstructure Cu6Sn5 is precipitated with rod like shape while CuZn is shown in bump oval shape whereas compounds that presented are Cu6Sn5 and Cu5Zn8 as shown in the XRD analysis result.

Inhibiting the growth of Sn whisker in Sn-9Zn lead-free solder by Nd and Ga

2014 ◽  
Vol 25 (6) ◽  
pp. 2671-2675 ◽  
Author(s):  
Peng Xue ◽  
Song-bai Xue ◽  
Yi-fu Shen ◽  
Hong Zhu
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Sn Whisker ◽  
Free Solder

Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition

2011 ◽  
Vol 40 (3) ◽  
pp. 344-354 ◽  
Author(s):  
F. X. Che ◽  
W. H. Zhu ◽  
Edith S. W. Poh ◽  
X. R. Zhang ◽  
Xiaowu Zhang ◽  
...  
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Creep Properties ◽  
Ni Addition ◽  
Free Solder

Influence of laminate type on tin whisker growth in tin-rich lead-free solder alloys

2012 ◽  
Vol 177 (15) ◽  
pp. 1286-1291 ◽  
Author(s):  
Agata Skwarek ◽  
Mariusz Pluska ◽  
Andrzej Czerwinski ◽  
Krzysztof Witek
Keyword(s):  
Whisker Growth ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Tin Whisker ◽  
Free Solder
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