Properties of lead-free solder SnAgCu containing minute amounts of rare earth

2003 ◽  
Vol 32 (4) ◽  
pp. 235-243 ◽  
Author(s):  
Zhigang Chen ◽  
Yaowu Shi ◽  
Zhidong Xia ◽  
Yanfu Yan
Keyword(s):  
Rare Earth ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Effects of rare earth element Nd on the solderability and microstructure of Sn–Zn lead-free solder

2010 ◽  
Vol 22 (5) ◽  
pp. 481-487 ◽  
Author(s):  
Yu-hua Hu ◽  
Song-bai Xue ◽  
Hui Wang ◽  
Huan Ye ◽  
Zheng-xiang Xiao ◽  
...  
Keyword(s):  
Rare Earth ◽  
Rare Earth Element ◽  
Earth Element ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

scholarly journals Modification in Bi-Ag Lead-Free Solder-Bearing Alloying Elements

2018 ◽  
Vol 14 (2) ◽  
pp. 5504-5519 ◽  
Author(s):  
Rizk Mostafa Shalaby ◽  
Musaeed Allzeleh ◽  
Mustafa Kamal
Keyword(s):  
Rare Earth ◽  
Electrical Resistance ◽  
Creep Resistance ◽  
Melting Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
Soldering Temperature ◽  
Urgent Task ◽  
Free Solder ◽  
Lead Free Solders

The development of lead-free solder has an urgent task for material scientist due to health and environmental concerns over the lead content of traditional solders. The objective of this study is to examine Bi-Ag-rare earth (RE) element considered as one of the more attractive lead-free solders since it can easily replace Sn-Pb eutectic alloy with increasing soldering temperature while causes for high-temperature applications. In order to enhance the soldering properties of Bi-Ag alloys, a trace eare earth (RE) element of Ho added into Bi-Ag alloys. The results indicated that the addition of RE led to the refining of coarse Bi-Ag grains, in the microstructure. The tensile strength, Hv and creep resistance increased with a decrease in melting point and electrical resistance. This paper brief the influences of rare earth alloying element and rapid solidification on both of the microstructure, intermetallic compounds, creep resistance, melting behavior, electrical resistance and mechanical behavior.

scholarly journals Effect of Rare Earth Metals on the Properties of Zn-20Sn High-Temperature Lead-Free Solder

2019 ◽  
Vol 48 (5) ◽  
pp. 2685-2690
Author(s):  
Jun Tian ◽  
Chunfu Hong ◽  
Lihua Hong ◽  
Xiaohui Yan ◽  
Pinqiang Dai
Keyword(s):  
Rare Earth ◽  
High Temperature ◽  
Rare Earth Metals ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

scholarly journals Effect of Terbium Additions on Microstructural, Thermal and Mechanical Properties of Eutectic Sn-3.5Ag Pb- Free Solder for Low Cost Electronic Assembly

2019 ◽  
Vol 16 (1) ◽  
pp. 79-94
Author(s):  
Rizk Mostafa Shalaby ◽  
Fatma Elzahraa Ibrahim ◽  
Mostafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Rare Earth ◽  
Earth Element ◽  
Low Cost ◽  
Solder Matrix ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal And Mechanical Properties ◽  
Electronic Assembly ◽  
Free Solder

This work methodically concentrated on the effect of a trace amount of rare earth element terbium, Tb (0.1, 0.2, 0.3, 0.4 and 0.5 wt. %) on the properties of eutectic Sn-3.5 wt. %Ag were studied. The results indicated that addition of Tb rare earth can be refined the microstructure of the solder and intermetallic compound (IMC) Ag3Sn phase appeared in the solder matrix. Add a few quantity of rare earth Tb enhances the hardness and strength of eutectic Sn-Ag lead free solder joint. Also, results indicate that adding Tb to the eutectic Sn-3.5Ag remarkably enhances solderability, reliability, thermal and mechanical properties. It is also found that increasing in mechanical strength can depend on crystalline size refining in addition to some regular precipitates from IMC, Ag3Sn.

scholarly journals Effect of rare earth Ce on the microstructure, physical properties and thermal stability of a new lead-free solder

2011 ◽  
Vol 47 (1) ◽  
pp. 11-21 ◽  
Author(s):  
W. Chen ◽  
J. Kong ◽  
W.J. Chen
Keyword(s):  
Rare Earth ◽  
Melting Temperature ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Wetting Properties ◽  
Wetting Property ◽  
Cast Alloys ◽  
Free Solder ◽  
Induced Aggregation

In this paper, in order to develop a low silver content lead-free solder with good overall properties, a newly designed solder alloys of Sn-0.3Ag-0.7Cu-20Bi-xCe type, with addition of varying amounts of rare earth Ce (0.05 mass%, 0.1 mass% and 0.2 mass%) were studied. The melting temperature of Sn-0.3Ag- 0.7Cu can be decreased substantially through addition of 20 mass% Bi; while the segregation of Bi element in the microstructure of the as-cast alloys can be relieved by micro-alloying with trace amount of rare earth Ce. Besides, aging treatments (160?C held for 6 h) of these solder alloys imply that appropriate amount of Ce addition can not only depress the diffusion induced aggregation of Bi in the microstructure but promote the homogenization during annealing. Compared with Bi-free Sn-0.3Ag-0.7Cu solder, Sn-0.3Ag-0.7Cu- 20Bi exhibits better wettability. More excitingly, the wetting property of Sn-0.3Ag-0.7Cu-20Bi can be further improved by doping little amounts of Ce, especially 0.5 mass%, in which case the spreading area of the solder can be increased to the largest extent. On the whole, the present study reveals that Sn-0.3Ag-0.7Cu- 20Bi-xCe (x=0.05-0.1) is a promising lead-free solder candidate considering the microstructure, melting temperature and wetting properties.

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